Abstract: A device includes a transistor. The transistor includes a plurality of stacked channels, a source/drain region coupled to the stacked channels, and a gate metal wrapped around the stacked channels. The transistor includes a plurality of inner spacers, each inner spacer being positioned laterally between the gate metal and the source/drain region and including a gap and an inner spacer liner layer between the gate metal and the source/drain region.

Abstract: A signal enhancement device includes a back cover and an antenna module. The back cover includes a backboard for covering a rear surface of a main body and a top board for covering a top of the main body. The antenna module includes a base portion of board shape for being fixed on a portion of an inside surface of the backboard adjacent to the top board, a first bending portion for being fixed on an inside surface of the top board, a second bending portion for being fixed on a front end surface of the top board, and a third bending portion for being fixed on an outside surface of the top board and a portion of an outside surface of the backboard adjacent to the top board. When the signal enhancement device is mounted on the main body, the antenna module is capable of coupling with a communication antenna of the main body so as to enhance signal quality of the communication antenna.