Patents by Inventor Guanboa HUI

Guanboa HUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8698149
    Abstract: An embodiment of the disclosed technology discloses an array substrate comprising: a base substrate; a first layer transparent common electrode formed on the base substrate; a gate metal common electrode formed on the first layer transparent common electrode; an insulation layer formed on the gate metal common electrode, with via holes being formed in the insulation layer; and a second layer transparent common electrode formed on the insulation layer. A side portion of via holes is in contact with the gate metal common electrode, another side portion is in contact with the first layer transparent common electrode, such that the second layer transparent common electrode is connected electrically with the first layer transparent common electrode and the gate metal common electrode in the via holes.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: April 15, 2014
    Assignee: Boe Technology Group Co., Ltd.
    Inventors: Guanboa Hui, Seungjin Choi, Feng Zhang
  • Publication number: 20120273789
    Abstract: An embodiment of the disclosed technology discloses an array substrate comprising: a base substrate; a first layer transparent common electrode formed on the base substrate; a gate metal common electrode formed on the first layer transparent common electrode; an insulation layer formed on the gate metal common electrode, with via holes being formed in the insulation layer; and a second layer transparent common electrode formed on the insulation layer. A side portion of via holes is in contact with the gate metal common electrode, another side portion is in contact with the first layer transparent common electrode, such that the second layer transparent common electrode is connected electrically with the first layer transparent common electrode and the gate metal common electrode in the via holes.
    Type: Application
    Filed: April 27, 2012
    Publication date: November 1, 2012
    Applicant: BOE TECHNOLOGY GROUP CO., LTD
    Inventors: Guanboa HUI, Seungjin CHOI, Feng ZHANG