Abstract: In a method, a mask is formed on a microstructure over a substrate. The mask includes a first pattern over a first region of the microstructure and a second pattern over a second region of the microstructure. A first etching process is performed to etch the microstructure by providing an etching gas and applying a first bias voltage to the substrate according to the first and second patterns of the mask. A protective layer is subsequently formed by providing a deposition gas and applying a second bias voltage to the substrate to cover the first pattern of the mask. A second etching process is performed to transfer the second pattern of the mask further into the second region of the microstructure. The deposition gas has a higher carbon to fluorine ratio than the etching gas, and the second bias voltage is smaller than the first bias voltage.

Abstract: An example operation may include one or more of receiving, by a data server node, requests for data from a plurality of user nodes connected to a blockchain, retrieving, by the data server node, the data from the blockchain, dividing, by the data server node, the data into a plurality of portions and generating copies of the plurality of the portions, changing, by the data server node, at least one bit in each of the copies, encrypting, by the data server node, the copies and recording the copies into blocks on a second blockchain, recording, by the data server node, a plurality of sequence numbers of the blocks, and storing, by the data server node, the plurality of the sequence numbers on a second blockchain to be accessed by the plurality of the user nodes.

Abstract: In a method, a mask is formed on a microstructure over a substrate. The mask includes a first pattern over a first region of the microstructure and a second pattern over a second region of the microstructure. A first etching process is performed to etch the microstructure by providing an etching gas and applying a first bias voltage to the substrate according to the first and second patterns of the mask. A protective layer is subsequently formed by providing a deposition gas and applying a second bias voltage to the substrate to cover the first pattern of the mask. A second etching process is performed to transfer the second pattern of the mask further into the second region of the microstructure. The deposition gas has a higher carbon to fluorine ratio than the etching gas, and the second bias voltage is smaller than the first bias voltage.

Abstract: In the disclosed method, a mask is formed on a microstructure. The mask includes a first pattern positioned over a first region of the microstructure and a second pattern positioned over a second region of the microstructure. A first etching process is performed to etch the microstructure according to the first and second patterns formed in the mask. The first etching process transfers the first and second patterns of the mask into the first and second regions of the microstructure, respectively. A protective layer is subsequently formed over the first pattern of the mask that is positioned over the first region of the microstructure. When the protective layer is formed, a second etching process is performed to etch the microstructure and transfer the second pattern of the mask further into the second region of the microstructure. The method also includes removing the mask and the protective layer from the microstructure.

Abstract: In the disclosed method, a mask is formed on a microstructure. The mask includes a first pattern positioned over a first region of the microstructure and a second pattern positioned over a second region of the microstructure. A first etching process is performed to etch the microstructure according to the first and second patterns formed in the mask. The first etching process transfers the first and second patterns of the mask into the first and second regions of the microstructure, respectively. A protective layer is subsequently formed over the first pattern of the mask that is positioned over the first region of the microstructure. When the protective layer is formed, a second etching process is performed to etch the microstructure and transfer the second pattern of the mask further into the second region of the microstructure. The method also includes removing the mask and the protective layer from the microstructure.

Abstract: An example operation may include one or more of receiving, by a data server node, requests for data from a plurality of user nodes connected to a blockchain, retrieving, by the data server node, the data from the blockchain, dividing, by the data server node, the data into a plurality of portions and generating copies of the plurality of the portions, changing, by the data server node, at least one bit in each of the copies, encrypting, by the data server node, the copies and recording the copies into blocks on a second blockchain, recording, by the data server node, a plurality of sequence numbers of the blocks, and storing, by the data server node, the plurality of the sequence numbers on a second blockchain to be accessed by the plurality of the user nodes.

Abstract: An LED (light emitting diode) lamp includes a lamp body, a plurality of fixing assemblies fixed to a top of the lamp body and a plurality of fasteners fixed to the fixing assemblies. The lamp body comprises a housing defining a plurality of runners in a top thereof and a light emitting module mounted in a bottom of the housing and applying an LED module as a light source. The fixing assemblies are placed on the top of the housing. Each fastener has a head located at an underside of a corresponding one of the fixing assemblies and securely received in a corresponding runner. The fixing assemblies are provided for securely fixing the LED lamp in position and in a desired illuminating angle.

Abstract: An LED lamp includes a plurality of LED light units juxtaposed together and a connecting member engaging with the LED light units. Each LED light unit includes a heat sink and an LED module engaged on the heat sink. The heat sink defines a groove group at each lateral portion thereof. The connecting member includes a plurality of inserts received in grooves of the groove groups of the heat sinks of neighboring LED light units and clasping the neighboring LED light units together thereby to secure the LED light units into the LED lamp.

Abstract: An LED lamp includes a plurality of LED light units juxtaposed together and a connecting member engaging with the LED light units. Each LED light unit includes a heat sink and an LED module engaged on the heat sink. The heat sink defines a groove group at each lateral portion thereof. The connecting member includes a plurality of inserts received in grooves of the groove groups of the heat sinks of neighboring LED light units and clasping the neighboring LED light units together thereby to secure the LED light units into the LED lamp.

Abstract: An LED (light emitting diode) lamp includes a lamp body, a plurality of fixing assemblies fixed to a top of the lamp body and a plurality of fasteners fixed to the fixing assemblies. The lamp body comprises a housing defining a plurality of runners in a top thereof and a light emitting module mounted in a bottom of the housing and applying an LED module as a light source. The fixing assemblies are placed on the top of the housing. Each fastener has a head located at an underside of a corresponding one of the fixing assemblies and securely received in a corresponding runner. The fixing assemblies are provided for securely fixing the LED lamp in position and in a desired illuminating angle.

Abstract: A method for processing data packet load balancing and a network equipment thereof, which are for balancing the load of a plurality of controllers in a network equipment. The method comprises the steps. A plurality of data packets is received. A storage queue is assigned for storing the data packets. The data packets in the storage queue are read by an allocation controller. The allocation controller assigns the data packets to different work sequences according to a work attribute of the data packets. A processing controller is commanded to perform a packet processing procedure, and at least one work queue is assigned to the processing controller for processing the data packets. After completing the packet processing procedure, the processing controller sends a completion message to a completion queue. If the allocation controller detects that the completion queue contains the completion message, the allocation controller sends the processed data packets back.

Abstract: A lamp includes a lamp pole, a lamp head and a locating slide. The lamp pole includes a connector. The lamp head includes a lamp body and a catch sleeve. The connector extends into the catch sleeve. The locating slide is engaged and sandwiched between the connector of the lamp pole and the catch sleeve. The locating slide is movable on the connector along a length direction thereof. A screw extends through the catch sleeve and screws into the locating slide to connect the locating sleeve and the catch sleeve together. When the locating slide together with the screw is moved from a first position to a second position, an elevation angle of the catch sleeve and accordingly the lamp body is varied.

Abstract: A network packet capturing method for capturing a plurality of packets from a physical layer to an application layer by a network server through a network card is described. The packet capturing method includes the following steps. Capture packets by a new application interface (NAPI); set a ring queue in a kernel; provide a hook process for capturing the packets; store the captured packets into the ring queue; and map the packets stored in the ring queue into a memory space of a corresponding application through memory mapping, thereby reducing the number of interrupts of the system and the number of replications during the packets parsing.

Abstract: A method of auto-deskewing a titled original image is provided. Frist, obtain an original image by scanning to acquire values of pixels in the orignal image. Next subject the original image to a binarization process. And, set a datum line in the original image. Then determine a tilting angle on the basis of the datum line. Finally, adjust the original image on the basis of the tilting angle. Therefore, the tilting angle of the original image may be acquired to adjust.