Patents by Inventor Guangbin Chen

Guangbin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, prepreg, laminate, and printed circuit board
    Patent number: 11261305
    Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: March 1, 2022
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Guangbin Chen, Qianfa Liu, Shanyin Yan, Xianping Zeng, Cuiming Du
  • Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board
    Patent number: 11053352
    Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: July 6, 2021
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Guangbin Chen, Qianfa Liu, Shanyin Yan, Xianping Zeng, Cuiming Du
  • VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
    Publication number: 20200247947
    Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.
    Type: Application
    Filed: July 26, 2019
    Publication date: August 6, 2020
    Inventors: Guangbin CHEN, Qianfa LIU, Shanyin YAN, Xianping ZENG, Cuiming DU
  • THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
    Publication number: 20200247970
    Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
    Type: Application
    Filed: July 26, 2019
    Publication date: August 6, 2020
    Inventors: Guangbin CHEN, Qianfa LIU, Shanyin YAN, Xianping ZENG, Cuiming DU
  • Wireless sport earphones
    Patent number: D836598
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: December 25, 2018
    Assignee: SHENZHEN WAHCHING TECHNOLOGY CO., LTD
    Inventor: Guangbin Chen