Abstract: An encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly are provided. The encapsulating composition includes polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin.

Abstract: The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4?n?10; R1 and R2 are both connected to Si atoms, and x+y is equal to the n; R1s are in pairwise alignment. R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged.

Abstract: The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

Abstract: Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-?-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

Abstract: The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.

Abstract: The disclosure provides a packaging adhesive film and a photovoltaic module. The packaging adhesive film includes a planar base layer and a buffer layer, the buffer layer is arranged on a surface of the planar base layer, and the buffer layer includes a plurality of buffer parts arranged at intervals, each one of the buffer part includes a long strip-shaped protrusion, and the long strip-shaped protrusion is arranged in a position corresponding to a photovoltaic ribbon, or arranged in a position corresponding to a cell piece gap in a photovoltaic module, or arranged in a position corresponding to a position of a depression of a lap portion of a laminated photovoltaic module, or arranged in a position corresponding to a position of a depression of a lap portion of a stacked tile photovoltaic module.

Abstract: Provided are an adhesive film, a composition for forming the same and an electronic device. The composition includes: a thermoplastic polymeric resin and an antistatic agent, the antistatic agent is an amide organic compound represented by Formula (I). The above antistatic agent contains a strong-polarity amide group and an optional polar group. The amide group may form an intramolecular hydrogen bond, which has a shorter bond length, and a dipole electric field generated by positive and negative ions formed after ionization is strong and a voltage generated by an external electrostatic field may be counteracted, such that the antistatic agent has a better antistatic property. The optional polar group may improve the above antistatic property: The thermoplastic polymeric resin has good thermal processability, and after it and the antistatic agent are subjected to melt extrusion, the adhesive film with the better antistatic property and processability may be formed.

Abstract: Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-?-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

Abstract: The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

Abstract: The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.

Abstract: Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al2O3, CaO/SiO2-doped Al2O3, MgO-doped Al2O3, SiO2-doped ZrO2, and TiO2-doped ZrO2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker.

Abstract: A resin composition and a use thereof are provided. The resin composition includes, in parts by weight, 100 parts of an alkali-soluble resin, 5-30 parts of acrylate monomers, 0.1-10 parts of photoinitiator, 10-30 parts of a first epoxy resin and 0-15 parts of a second epoxy resin. The first epoxy resin is a low-dielectric epoxy resin with a dielectric constant of <3.5 and the second epoxy resin is different from the first epoxy resin. With the addition of the low epoxy resin with the dielectric constant of >3.5, and by adjusting the ratio of the components, the resin composition significantly reduces the dielectric constant and dielectric loss, the dielectric constant is reduced to 3.0 or less, and the dielectric loss is reduced to 0.008 or less.

Abstract: The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist. It has characteristics such as easy breakage of film strip, smaller film strip fragments, faster film strip speed, excellent flexibility, and good circuit resolution and adhesion, thereby effectively improving production efficiency and product yield.

Abstract: The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticizer, 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling.

Abstract: The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

Abstract: A highly reflective gain type photovoltaic packaging adhesive film and usage are provided. The packaging adhesive film is composed of an packaging layer and a reflecting layer, wherein the packaging layer has a thickness of 200 to 500 ?m, and is made by mixing a first primary resin, a modified auxiliary, an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and melting and coat casting the same at 60° C. to 200° C. to form a film; and the reflecting layer has a thickness of 5 to 200 ?m and is made by mixing a second primary resin, an auxiliary resin, a first filler, a second filler, modified auxiliary, a diluent and an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and coating the same on the surface of the packaging layer and curing the same at 30° C. to 150° C.