Abstract: A method for manufacturing a side wire for a substrate and a substrate structure are provided. The method includes: forming a plurality of first pattern structures on a side surface of the substrate, wherein a gap between any adjacent two of the plurality of first pattern structures connects a top surface and a bottom surface of the substrate to each other; forming a conductive material film covering the side surface of the substrate; and removing the plurality of first pattern structures and a portion of the conductive material film that is attached on the plurality of first pattern structures, and maintaining a portion of the conductive material film that is located between any adjacent two of the plurality of first pattern structures as the side wire.

Abstract: The present document discloses a method and device for upgrading software. The method includes: a terminal setting a time for upgrading a software version for next time according to an upgrade status of a current software version; detecting the software version according the set time; if a new software version is detected, acquiring an upgrade package of the new software version in a wireless way; and upgrading partition data segment by segment in a partitioned upgrade method by using the acquired upgrade package. The present document can improve the success rate for downloading the software, and complete the backup protection for the original software version and the data error processing caused by abnormal power-fail.