Abstract: A test probe for a high-frequency device having an electronic circuit with two or more contact regions. The test probe comprises two or more signal probe tips. Each signal probe tip has a contact surface area for contacting one of the contact regions of the device. A ground probe has a ground contact surface with a surface area substantially greater than the contact surface area of the one signal probe tip for contacting another one of the contact regions of the electronic circuit. The ground probe is positioned between at least two of the signal probes.

Abstract: One aspect of the invention is a method of measuring the speed at which a variational gravitational field propagates. The gravitational field relates to a planet, and the planet has object of sufficient mass to change the gravitational field.

Abstract: A low-voltage wide band micro electrical mechanical (MEM) switch. The low-voltage MEM switch comprises a contact bridge. A microstrip has an impedance of about 50 Ohms, first and second portions, and a gap defined between the first and second portions. A cantilever arm supports the contact bridge. The cantilever arm has an end portion, an open state, and a closed state. The contact bridge is spaced from the microstrip at a distance of about 12 &mgr;m or greater when the cantilever arm is in the open state. The contact bridge provides electrical communication between the first and second portions of the microstrip when the cantilever arm is in the closed state. An electrically conductive coil opposes the first end, wherein the electrically conductive coil moves the cantilever arm from the open state to the closed state when a voltage of about 5 Volts or less are applied across the electrically conductive coil. A housing encloses the cantilever arm, microstrip, and electrically conductive coil.

Abstract: An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.

Abstract: One aspect of the invention is a method of measuring the speed at which a variational gravitational field propagates. The gravitational field relates to a planet, and the planet has object of sufficient mass to change the gravitational field.

Abstract: An apparatus for processing a high-frequency electrical signal. The apparatus comprises a circuit carrier and an electrical circuit mounted on the circuit carrier. The electrical circuit processes a signal within a predetermined frequency range, the predetermined fundamental frequency range having a low end in the range being about 1 GHz or higher. An encapsulent material encapsulates at least a portion of the electrical circuit. The circuit carrier, electrical circuit, and encapsulent material form a package having resonant frequencies. The resonant frequencies are outside the predetermined frequency range.

Abstract: An apparatus for directing light into the end of an optical fiber. The apparatus comprises a funnel member having an axis and an endless wall. At least a portion of the endless wall has a conical shape and an interior surface defining an interior volume. The funnel member has a first end having a cross-sectional area and a second end having a cross-sectional area. The cross sectional area of the first end is larger than the cross-sectional area of the second end. A collar is proximal to the second end of the funnel member. A coating covers at least a portion of the interior surface and forms a light reflective surface. The reflective surface faces at least a portion of the interior volume. At least a portion of the sidewall has an angle relative to the axis.

Abstract: A low-voltage wide band micro electrical mechanical (MEM) switch. The low-voltage MEM switch comprises a contact bridge. A microstrip has an impedance of about 50 Ohms, first and second portions, and a gap defined between the first and second portions. A cantilever arm supports the contact bridge. The cantilever arm has an end portion, an open state, and a closed state. The contact bridge is spaced from the microstrip at a distance of about 12 &mgr;m or greater when the cantilever arm is in the open state. The contact bridge provides electrical communication between the first and second portions of the microstrip when the cantilever arm is in the closed state. An electrically conductive coil opposes the first end, wherein the electrically conductive coil moves the cantilever arm from the open state to the closed state when a voltage of about 5 Volts or less are applied across the electrically conductive coil. A housing encloses the cantilever arm, microstrip, and electrically conductive coil.

Abstract: In the first circuit arrangement, a low noise balanced microwave amplifier includes an input coupler having an integrated noise-matching circuit, a single-ended amplifier in each branches, and an output coupler. The impedance at each output port of the input coupler is set close or equal to the optimum noise source impedance of an active gain device in the single-ended. No additional circuit element or only one shunt inductor or capacitor is needed for the noise matching. The total insertion loss of the input network is reduced to improve the overall noise figure. In the second circuit arrangement, two low noise amplifiers of microwave monolithic integrated circuit (MMIC) are used for the active gain device within the balanced amplifier.

Abstract: One aspect of the invention is a method of measuring the speed at which a variational gravitational field propagates. The gravitational field relates to a planet, and the planet has object of sufficient mass to change the gravitational field.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: A testing apparatus that comprises an electrical device. A first circuit is in electrical communication with the electrical device. The first circuit including an amplifier. First and second couplers are electrically connected to the first circuit and arranged in series with the amplifier. The amplifier is positioned between the first and second couplers. A second circuit has a first end in electrical communication with the first coupler and a second end in electrical communication with the second coupler. The total gain of the first coupler, the second coupler, the portion of the first circuit between the first and second couplers, and the second circuit is approximately zero.

Abstract: Wireless communications devices, such as mobile telephones and pagers, has have recently been allowed to operate at higher frequencies in the 27-32 Giga-Hertz range. These higher-frequency devices typically include a multi-tiered electronic assembly, which includes an integrated-circuit chip, a chip carrier, and a main circuit board, with the chip carrier sandwiched between the chip and the main circuit board. Testing these multi-tiered assemblies conventionally entails manually coupling test probes to specific contact regions of the circuit board, applying test signals to the board, and ultimately keeping or discarding the entire board based on the testing. This method is not only slow and wasteful, but sometimes requires the circuit board to include extra ground contacts that can disrupt normal circuit operation. Accordingly, the present inventors have devised unique test probes and related systems and methods for testing these and other high-frequency electronic assemblies.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.

Abstract: A testing apparatus that comprises an electrical device. A first circuit is in electrical communication with the electrical device. The first circuit including an amplifier. First and second couplers are electrically connected to the first circuit and arranged in series with the amplifier. The amplifier is positioned between the first and second couplers. A second circuit has a first end in electrical communication with the first coupler and a second end in electrical communication with the second coupler. The total gain of the first coupler, the second coupler, the portion of the first circuit between the first and second couplers, and the second circuit is approximately zero.

Abstract: A resonator filter comprising a housing formed with a conductive material. The housing defines a first cavity, a second cavity, and an intermediate wall positioned between the first and second cavities. The housing defines an opening between the first and second cavities. First and second center conductors are positioned within the first and second cavities, respectively. A coupling wire is connected between the first center conductor and the housing. The coupling wire and the center conductor have substantially equal thermal expansion coefficients.

Abstract: A circuit arrangement that reduces selected intermodulation. The circuit arrangement includes a signal amplifier coupled to a bandpass filter via an electrical path. Signal energy outside the passband is reflected back into the amplifier and causes intermodulation. The electrical path is constructed with a length that reduces intermodulation, where the length is an odd multiple of one-fourth the wavelength of a predetermined frequency in the passband. The length of the electrical path reduces intermodulation because certain signals reflected by the bandpass filter are approximately 180.degree., or an odd multiple thereof, out of phase. Energy of problematic signals that are near the edge of the passband or in the stopband is reduced, such as third order intermodulation product and pairs of signals that produce third order intermodulation products.

Abstract: A bandpass filter arrangement that includes a weakly coupled coaxial resonator to reduce the fluctuation in frequency response of the filter arrangement. A bandpass filter is coupled to the output of a low noise amplifier. The characteristic fluctuation in frequency response in the passband of the bandpass filter is reduced with a coaxial resonator that is disposed proximate the filter arrangement.