Abstract: The embodiments of the present disclosure provide a method for troubleshooting potential safety hazards of a compressor in a smart gas pipeline network and an Internet of Things system thereof. The method comprises: performing a purification process on sound data of a gas compressor, and determining a target sound feature; establishing a feature data vector library based on networked data and reference device data; determining a current gas data vector and a current device data vector based on gas data and device data, respectively; searching the feature data vector library based on the current gas data vector and the current device data vector, and determining a reference sound feature and a reference vibration feature that meet a preset condition as a standard sound feature and a standard vibration feature; and predicting whether there is a safety hazard in the gas compressor using a hazard model.

Abstract: The embodiments of the present disclosure provide a method for predicting gas transmission loss of smart gas, implemented by a smart gas equipment management platform of an Internet of Things (IoT) system for predicting gas transmission loss of smart gas, comprising: obtaining gas flow data, gas pressure data, and ambient temperature data of a plurality of time points respectively based on gas metering devices, pressure detection devices, and temperature monitoring devices at a plurality of positions of a gas pipeline network; predicting a gas metering error based on the ambient temperature data; determining whether gas loss is abnormal loss based on the gas flow data, the gas pressure data, and the gas metering error; and in response to a determination that the gas loss is the abnormal loss, sending a warning notice.

Abstract: A micromachined capacitive flow sensor includes a movable membrane having one or more venting holes and a perforated backplate having perforation holes or through holes. A gas gap (such as an air gap) is formed between the movable membrane and the perforated backplate. The movable membrane, the gas gap and the perforated backplate form a variable capacitor whose capacitance varies with a movement of the membrane relative to the perforated backplate. The sensor may be used to manufacture a packaged flow sensor product which may find numerous applications, for example, using the product as a switch to turn on and off the electric power to the heating elements of the aerosol delivery device in response to the puff and/or smoking action of the user.

Abstract: Embodiments of the present application provide a silicon-based microphone apparatus and an electronic device. The silicon-based microphone apparatus comprises: a circuit board provided with at least two sound inlet holes; a shielding cover covering one side of the circuit board to form an acoustic cavity; at least two silicon-based microphone chips both provided on one side of the circuit board and located in the acoustic cavity, back cavities of the silicon-based microphone chips being communicated with the sound inlet holes in one-to-one correspondence; and a differential control chip, microphone structures of all the silicon-based microphone chips being sequentially electrically connected and then being electrically connected to an input end of the differential control chip.

Abstract: Embodiments of the present application provide a silicon based microphone apparatus and an electronic device. The silicon based microphone apparatus comprises: a circuit board provided with at least one sound inlet hole; a shielding cover covering one side of the circuit board to form an acoustic cavity; at least two differential silicon based microphone chips arranged on one side of the circuit board and located within the acoustic cavity, back cavities of some differential silicon based microphone chips being communicated with the sound inlet holes in one-to-one correspondence; and a separator located within the acoustic cavity and used for separating the acoustic cavity into sub-acoustic cavities corresponding to the back cavities of at least some adjacent differential silicon based microphone chips.

Abstract: Provided in the embodiments of the present application are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises: a circuit board, provided with at least two sound inlets; a shielding cover, covering one side of the circuit board to form an acoustic cavity; at least two differential silicon-based microphone chips, both being provided on one side of the circuit board and arranged within the acoustic cavity; rear cavities of the differential silicon-based microphone chips being in communication in a one-to-one correspondence with the sound inlets; and a separating element, arranged within the acoustic cavity, and separating the acoustic cavity into acoustic subcavities corresponding to the rear cavities of at least some of the adjacent differential silicon-based microphone chips.

Abstract: The present invention provides a MEMS microphone comprising (i) a substrate layer, (ii) a fixed backplate, and (iii) an intermediate layer sandwiched between the substrate layer and the fixed backplate. The substrate layer has a first opening through the thickness of the substrate layer. The intermediate layer has a second opening through the thickness of the intermediate layer. The fixed backplate forms a ceiling of the second opening, and the second opening is larger than the first opening and extends into the first opening, forming a looped recess (“undercut”). The looped recess is defined by a looped ledge on the substrate, a looped sidewall around the second opening, and a looped ceiling from the fixed backplate. The looped sidewall and the looped ceiling are made of a same material.

Abstract: Provided are a silicon-based microphone device and an electronic apparatus. The silicon-based microphone device comprises: a circuit board, provided with at least two sound inlets; a shielding housing, covering one side of the circuit board; an even number of differential silicon-based microphone chips, which are arranged within an acoustic cavity, between every two differential silicon-based microphone chips, a first microphone structure of either differential silicon-based microphone chip being electrically connected to a second microphone structure of the other differential silicon-based microphone chip, and the second microphone structure of either differential silicon-based microphone chip being electrically connected to the first microphone structure of the other differential silicon-based microphone chip; and, a mounting plate, provided with at least one opening, the opening being in communication with some of the sound inlets.

Abstract: The present invention provides a capacitive microphone such as a MEMS microphone with two capacitors. The signal output from the first capacitor is additive inverse of that from the second capacitor, and a total signal output is a difference between the two outputs. In at least one of the two capacitors, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed capacitor plate, instead of moving toward/from the fixed plate. The squeeze film damping, and the noise are substantially avoided, and the performances of the microphone is significantly improved.

Abstract: The present invention provides a capacitive microphone such as a MEMS microphone with two capacitors. The signal output from the first capacitor is additive inverse of that from the second capacitor, and a total signal output is a difference between the two outputs. In at least one of the two capacitors, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed capacitor plate, instead of moving toward/from the fixed plate. The squeeze film damping, and the noise are substantially avoided, and the performances of the microphone is significantly improved.

Abstract: Provided are a silicon-based microphone device and an electronic apparatus. The silicon-based microphone device comprises: a circuit board, wherein at least two sound inlets are formed on the circuit board; a shielding housing that covers one side of the circuit board; an even number of differential silicon-based microphone chips that all are located in a sound cavity, wherein in each two differential silicon-based microphone chips, the first microphone structure of one differential silicon-based microphone chip is electrically connected to the second microphone structure of the other differential silicon-based microphone chip, and the second microphone structure of said one differential silicon-based microphone chip is electrically connected to the first microphone structure of said other differential silicon-based microphone chip; and a mounting plate, wherein an even number of holes communicated with the sound inlets are formed on the mounting plate.

Abstract: Provided are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises a circuit board, a shielding housing and at least two differential silicon-based microphone chips, wherein at least two sound inlet holes are provided on the circuit board, the shielding housing covers one side of the circuit board and forms a sound cavity with the circuit board, the silicon-based microphone chips are all located inside the sound cavity, the differential silicon-based microphone chips are respectively disposed at the sound inlet holes, and a back cavity of each differential silicon-based microphone chip is communicated with the sound inlet hole at the corresponding position, each of the differential silicon-based microphone chips comprises a first microphone structure and a second microphone structure, all of the first microphone structures are electrically connected, and all of the second microphone structures are electrically connected.

Abstract: The present invention provides a capacitive microphone including a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to a fixed backplate, instead of moving toward/from the fixed backplate. The fixed backplate includes an electrical insulator sandwiched between two sub-conductors to cancel systematic/background noise. The squeeze film damping is substantially avoided, and the performance, such as signal to noise ratio, of the microphone is significantly improved.

Abstract: The present invention provides a process of fabricating a capacitive microphone such as a MEMS microphone. In the process, one electrically conductive layer is deposited on a removable layer, and then divided or cut into two divided layers, both of which remain in contact with the removable layer as they were. One of the two divided layers will become or include a movable or deflectable membrane/diaphragm that moves in a lateral manner relative to another layer, instead of moving toward/from another layer. A motional sensor is optionally fabricated within the microphone to estimate the noise introduced from acceleration or vibration of the microphone for the purpose of compensating the microphone output through a signal subtraction operation.

Abstract: The present invention provides a general MEMS device having a pair of quadrilateral insert and trench. An air channel/space includes a first internal wall and a second internal wall for air to flow between. A quadrilateral trench is recessed from the first internal wall, and a quadrilateral insert is extended from the second internal wall and inserted into the trench. In capacitive MEMS microphone, the spatial relationship between the insert and the trench can vary or oscillate. The quadrilateral insert & trench serve as an air flow restrictor or a leakage prevention structure which keeps the sound frequency response plot of the microphone flatter in the range of 20 Hz to 1000 Hz. The level of the air resistance may be controlled e.g. by the depth of quadrilateral trench/slot etched on the substrate.

Abstract: The present invention provides a MEMS microphone comprising (i) a substrate layer, (ii) a fixed backplate, and (iii) an intermediate layer sandwiched between the substrate layer and the fixed backplate. The substrate layer has a first opening through the thickness of the substrate layer. The intermediate layer has a second opening through the thickness of the intermediate layer. The fixed backplate forms a ceiling of the second opening, and the second opening is larger than the first opening and extends into the first opening, forming a looped recess (“undercut”). The looped recess is defined by a looped ledge on the substrate, a looped sidewall around the second opening, and a looped ceiling from the fixed backplate. The looped sidewall and the looped ceiling are made of a same material.

Abstract: A sensor with both Coriolis tube and thermal tube is used to measure the mass flow rate of the fluid using both the Coriolis principle and the thermal method simultaneously. Above certain flow rate, the flow rate is measured by the Coriolis tube and below that flow rate, it is measured by the thermal tube. The Coriolis tube and the thermal tube are arranged parallelly with the common inlet and outlet. Two resistant coils are wound on the thermal tube to do the thermal measurement and a magnetic disk is attached to the Coriolis tube, work together with an excitation coil and two optical sensors to do the Coriolis flow measurement. It takes the advantages of both technologies and create a flow sensor which is super accurate, gas type insensitive, long-term stable and fast responsive without too much pressure drop.

Abstract: A U-shaped tube is used to measure the mass flow rate of the fluid using both thermal method and the Coriolis principle simultaneously. Two resistant coils are wound on the tube to do the thermal measurement and an excitation coil and two optical sensors are used to do the Coriolis flow measurement. It takes the advantages of both technologies and create a flow sensor which is super accurate, gas type insensitive, long-term stable and fast responsive without too much pressure drop.

Abstract: The present invention provides a process of fabricating a capacitive microphone such as a MEMS microphone with two capacitors. The two capacitors may be so fabricated that the signal output from the first capacitor is additive inverse of that from the second capacitor, and a total signal output is a difference between the two outputs. In at least one of the two capacitors, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed capacitor plate, instead of moving toward/from the fixed plate. The squeeze film damping, and the noise are substantially avoided, and the performances of the microphone are significantly improved.

Abstract: The present invention provides a process of fabricating a capacitive microphone such as a MEMS microphone with two capacitors. The two capacitors may be so fabricated that the signal output from the first capacitor is additive inverse of that from the second capacitor, and a total signal output is a difference between the two outputs. In at least one of the two capacitors, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed capacitor plate, instead of moving toward/from the fixed plate. The squeeze film damping, and the noise are substantially avoided, and the performances of the microphone are significantly improved.