Abstract: A server and a server system are provided. The server system includes a server and a cooling medium distributing device. The server includes a first electronic node, a second electronic node, and a cooling connection device. The first electronic node and the second electronic node are connected with the cooling medium distributing device through the cooling connection device. The cooling medium distributing device conveys a liquid cooling medium of the same working medium to the first electronic node and the second electronic node, so that the first electronic component of the first electronic node can dissipate heat in a two-phase heat dissipation mode, and the second electronic component of the second electronic node can dissipate heat in a single-phase liquid cooling manner.

Abstract: The cooling medium distribution apparatus includes a first heat exchanger, a second heat exchanger, a liquid storage tank, and a delivery pump. An input end of the first runner is configured to allow a gaseous first cooling medium to flow in, and an output end of the first runner is in communication with an input end of the liquid storage tank. An output end of the liquid storage tank is configured to be in communication with an input end of the delivery pump, and an output end of the delivery pump is configured to allow a liquid first cooling medium to flow out. The second runner is used for flowing of a second cooling medium to exchange heat with the first cooling medium in the first runner. The second heat exchanger enables the second cooling medium in the third runner to exchange heat with the first cooling medium.

Abstract: This application provides a flexible liquid cooling heat dissipation unit. The flexible liquid cooling heat dissipation unit is configured to dissipate heat for a heat generation component. A liquid inlet and a liquid outlet are provided on the flexible liquid cooling heat dissipation unit. A heat exchange cavity that is used for accommodating a coolant and allowing the coolant to flow from the liquid inlet to the liquid outlet is provided in the flexible liquid cooling heat dissipation unit. The liquid cooling heat dissipation unit includes a flexible sheet material. The flexible sheet material is obtained by compounding a plurality of functional film layers, the plurality of functional film layers include at least one anti-penetration layer, and permeability of the anti-penetration layer is less than 1 g/m2/24 hr.

Abstract: A liquid cooling node is provided, the node includes a sealed compartment, a cooling component, two first connectors, and two second connectors. The sealed compartment is filled with a first medium. The cooling component is disposed in the sealed compartment, and the cooling component is filled with a second medium. The first connectors are disposed on a side wall of the sealed compartment, and are communicated with the sealed compartment to form a first cooling path. The second connectors are disposed on the side wall of the sealed compartment, and are communicated with the cooling component to form a second cooling path. In this application, a heat dissipation problem of a single high-power main chip can be resolved, so that an entire data center node maintains a low temperature for a long time.

Abstract: The present invention provides a front panel of a board, a board, and an electronic apparatus. The front panel of the board includes a main body of the front panel, configured to fixedly connect to a circuit board on the board, and a fixing apparatus, where the fixing apparatus is fixedly disposed on the main body of the front panel, and is configured to fix the board in a shelf after the board is installed into the shelf. The fixing apparatus is fixedly disposed on the front panel of the board. After the board is installed into the shelf, the board may be securely fixed in the shelf through the fixing apparatus that is on the front panel of the board, so that a connector of the board keeps good contact with a connector of the shelf, thereby improving reliability of a connection between the board and the shelf.

Abstract: The present invention discloses a splitter plate and an electronic apparatus. The splitter plate includes a splitter plate main body, and further includes a turnover positioning apparatus, and the turnover positioning apparatus is hinged on a side of the splitter plate main body; the turnover positioning apparatus is configured to, after a half-height board is assembled to a subrack, abut against the half-height board and connect to the subrack to fasten the half-height board to the subrack.

Abstract: The present invention discloses a splitter plate and an electronic apparatus. The splitter plate includes a splitter plate main body, and further includes a turnover positioning apparatus, and the turnover positioning apparatus is hinged on a side of the splitter plate main body; the turnover positioning apparatus is configured to, after a half-height board is assembled to a subrack, abut against the half-height board and connect to the subrack to fasten the half-height board to the subrack.