Patents by Inventor Guangning Fu

Guangning Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9621331
    Abstract: A method and apparatus for synchronizing operations between a first circuit and a second circuit is disclosed. The method involves writing receive data from the first circuit to a first ring buffer at a first rate. The first ring buffer has a fixed-length of buffer elements and respective read and write buffer pointers. The buffered receive data is read from the first ring buffer to the second circuit at a second data rate. The respective positions of the read and write buffer pointers are detected, and a relative position between the read and write pointers is dynamically adjusted to enforce at least a predetermined minimum spacing. The dynamic adjustment comprises selectively adding or deleting portions of the data to or from the ring buffer.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: April 11, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Mindong Zhou, Guangning Fu, Wenjia Wu
  • Publication number: 20150124841
    Abstract: A method and apparatus for synchronizing operations between a first circuit and a second circuit is disclosed. The method involves writing receive data from the first circuit to a first ring buffer at a first rate. The first ring buffer has a fixed-length of buffer elements and respective read and write buffer pointers. The buffered receive data is read from the first ring buffer to the second circuit at a second data rate. The respective positions of the read and write buffer pointers are detected, and a relative position between the read and write pointers is dynamically adjusted to enforce at least a predetermined minimum spacing. The dynamic adjustment comprises selectively adding or deleting portions of the data to or from the ring buffer.
    Type: Application
    Filed: June 18, 2012
    Publication date: May 7, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventors: Mindong Zhou, Guangning Fu, Wenjia Wu