Abstract: A suction sampler system for in situ collection of deep-sea floor organisms includes a pressure-retaining cylinder, a pressure compensation device, a cone component, semiconductor refrigeration components, a circuit cylinder and a collection cylinder. Two ends of the pressure-retaining cylinder are respectively equipped with a first and second seal mechanisms, and the cone component is arranged in the pressure-retaining cylinder. The pressure compensation device is connected to the pressure-retaining cylinder through a high-pressure pipe. The semiconductor refrigeration components are arranged outside the pressure-retaining cylinder. The circuit cylinder is equipped with a power supply and a controller, and the semiconductor refrigeration components are connected to the controller. A pressure sensor and a temperature sensor are arranged inside the pressure-retaining cylinder, and respectively connected to the controller.

Abstract: A full-sea depth multi-point in-situ sampler includes a sampling assembly, a pressure-retaining assembly, a pressure-compensating assembly, and a cleaning assembly. The sampling assembly includes a handle, an extrusion valve, a needle valve core, a two-stage piston, a sampling tube, and a capturing device. The pressure-retaining assembly includes a pressure-retaining cylinder, a locking mechanism, a floating valve core, a support spring, and a drainage device. The pressure-compensating assembly includes a pressure-compensating cylinder, a piston, and an end cap. The cleaning assembly includes a cleaning sleeve, a cleaning cylinder, and multiple trigger mechanisms. A sampling and transfer method based on the sampler is also provided.

Abstract: A suction sampler system for in situ collection of deep-sea floor organisms includes a pressure-retaining cylinder, a pressure compensation device, a cone component, semiconductor refrigeration components, a circuit cylinder and a collection cylinder. Two ends of the pressure-retaining cylinder are respectively equipped with a first and second seal mechanisms, and the cone component is arranged in the pressure-retaining cylinder. The pressure compensation device is connected to the pressure-retaining cylinder through a high-pressure pipe. The semiconductor refrigeration components are arranged outside the pressure-retaining cylinder. The circuit cylinder is equipped with a power supply and a controller, and the semiconductor refrigeration components are connected to the controller. A pressure sensor and a temperature sensor are arranged inside the pressure-retaining cylinder, and respectively connected to the controller.