Abstract: An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.

Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: A spiral-orifice ceramic filter for metal casting, including spiral channels and two drain openings, where the spiral channels are distributed in a ceramic substrate in a staggered manner. By adoption of the spiral channel structure, molten metal may rotate to generate a centrifugal force while flowing forwards so as to promote separation of inclusions. The spiral-orifice ceramic filter for metal casting includes the following components: 90-95 wt % of MgO, 4-8 wt % of SiO2 and 2-4 wt % of ZrO2. Therefore, the spiral-orifice ceramic filter for metal casting has high strength under normal temperature and optional thermal impact resistance under high temperature, and may tolerate the impact of molten metal at 1700° C. or higher without break. The ceramic substrate and the spiral channel are superficially coated with one layer of functional oxide prepared from CaO.2Al2O3, CaO.6Al2O3, Al2O3, TiO2, or Re2O3.

Abstract: A spiral-orifice ceramic filter for metal casting, including spiral channels and two drain openings, where the spiral channels are distributed in a ceramic substrate in a staggered manner. By adoption of the spiral channel structure, molten metal may rotate to generate a centrifugal force while flowing forwards so as to promote separation of inclusions. The spiral-orifice ceramic filter for metal casting includes the following components: 90-95 wt % of MgO, 4-8 wt % of SiO2 and 2-4 wt % of ZrO2. Therefore, the spiral-orifice ceramic filter for metal casting has high strength under normal temperature and optional thermal impact resistance under high temperature, and may tolerate the impact of molten metal at 1700° C. or higher without break. The ceramic substrate and the spiral channel are superficially coated with one layer of functional oxide prepared from CaO.2Al2O3, CaO.6Al2O3, Al2O3, TiO2, or Re2O3.