Abstract: The present disclosure relates to a wood-plastic coated metal composite profile and a production process, and belongs to the technical field of composite profiles. The wood-plastic coated metal composite profile includes a metal core material, a wood-plastic surface layer and an intermediate layer provided between the metal core material and the wood-plastic surface layer. The intermediate layer includes unsaturated carboxylic acid modified polyolefin and thermoplastic polyurethane elastomer, inorganic filler, polyurethane prepolymer. In the present disclosure, an intermediate layer is provided between the wood-plastic surface layer and the metal core material for bonding. The intermediate layer has excellent performance when bonding with the metal, and at the same time, it can blend with the wood-plastic surface layer to a certain extent during co-extrusion.

Abstract: The present disclosure relates to a wood-plastic coated metal composite profile and a production process, and belongs to the technical field of composite profiles. The wood-plastic coated metal composite profile includes a metal core material, a wood-plastic surface layer and an intermediate layer provided between the metal core material and the wood-plastic surface layer. The intermediate layer includes unsaturated carboxylic acid modified polyolefin and thermoplastic polyurethane elastomer, inorganic filler, polyurethane prepolymer. In the present disclosure, an intermediate layer is provided between the wood-plastic surface layer and the metal core material for bonding. The intermediate layer has excellent performance when bonding with the metal, and at the same time, it can blend with the wood-plastic surface layer to a certain extent during co-extrusion.

Abstract: A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.

Abstract: A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.