Patents by Inventor Guangwei Wu
Guangwei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240116952Abstract: The disclosure relates to KRASG12D inhibitor compounds having the structure of Formula (A) or Formula (B), pharmaceutical compositions thereof, and methods of use thereof for inhibiting, treating, and/or preventing KRASG12D mutation-associated diseases, disorders and conditions.Type: ApplicationFiled: September 8, 2023Publication date: April 11, 2024Inventors: Jiasheng LU, Xiang JI, Xianchao DU, Yanpeng WU, Xiaolin HE, Guangwei REN, Lina CHU, Chuanhao HUANG, Xingwu ZHU, Yuhua ZHANG, Jian GE, Tianlun ZHOU, Xiangsheng YE, Xianqi KONG, Dawei CHEN
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Patent number: 9796063Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: June 30, 2014Date of Patent: October 24, 2017Assignee: FNS TECH CO., LTD.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
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Patent number: 9162341Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: GrantFiled: May 6, 2013Date of Patent: October 20, 2015Assignee: FNS TECH CO., LTDInventors: Paul LeFevre, Anoop Mathew, Scott Xin Qiao, Guangwei Wu, David Adam Wells, Oscar K. Hsu
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Publication number: 20140311043Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN
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Patent number: 8790165Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: January 5, 2010Date of Patent: July 29, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
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Patent number: 8758659Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: GrantFiled: September 29, 2010Date of Patent: June 24, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Guangwei Wu, Anoop Mathew
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Patent number: 8684794Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.Type: GrantFiled: August 4, 2008Date of Patent: April 1, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20130244548Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: ApplicationFiled: May 6, 2013Publication date: September 19, 2013Inventors: Paul LEFEVRE, Anoop MATHEW, Scott Xin QIAO, Guangwei WU, David Adam WELLS, Oscar K. HSU
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Patent number: 8435099Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: GrantFiled: January 27, 2010Date of Patent: May 7, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, David Adam Wells, Oscar K. Hsu, Xuechan Zhao
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Patent number: 8377351Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: GrantFiled: October 2, 2008Date of Patent: February 19, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, David Adam Wells, Marc C. Jin, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20120073210Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Guangwei WU, Anoop MATHEW
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Publication number: 20100221985Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: ApplicationFiled: January 27, 2010Publication date: September 2, 2010Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Anoop MATHEW, Scott Xin QIAO, Xuechan Zhao, Guangwei WU, David Adam WELLS, Oscar K. HSU
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Publication number: 20100221983Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: January 5, 2010Publication date: September 2, 2010Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Xuechan Zhao
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Publication number: 20090246504Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: ApplicationFiled: October 2, 2008Publication date: October 1, 2009Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, David Adam WELLS, Marc C. JIN, Oscar K. HSU, John Erik ALDEBORGH, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20070087177Abstract: The following is a description of a stacked pad 15 for chemical mechanical polishing and/or planarizing substrates. In one embodiment, the stacked pad includes a top pad 20 and a subpad 40 where the modulus of the top pad 20 substantially equals the modulus of the subpad 40. Also presented are methods of using the stacked pad 15 which include methods of chemical mechanical polishing and/or planarization, and products of using the stacked pad.Type: ApplicationFiled: October 12, 2004Publication date: April 19, 2007Inventors: Guangwei Wu, Steve Kirtley, Thomas West
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Patent number: 7118461Abstract: Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.Type: GrantFiled: March 24, 2003Date of Patent: October 10, 2006Assignee: Thomas West Inc.Inventors: Thomas E. West, Guangwei Wu, Donald P. Dietz
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Publication number: 20040251126Abstract: A metal-based fuel cell in which a flow path delivers a flow of reaction solution through a particulate anode and one or more particle releasers are situated along the flow path and configured to release from the cell particles which are prone to clogging due to reductions in size caused by anodic dissolution.Type: ApplicationFiled: October 19, 2001Publication date: December 16, 2004Inventors: Martin de Tezanos Pinto, Stuart I. Smedley, Guangwei Wu
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Publication number: 20040053132Abstract: Improved fuel compositions have improved flow properties for use in zinc/air (oxygen) fuel cell systems. In some embodiments, an improved fuel composition comprises a collection of particles having zinc and at least one non-zinc metal having improved physical properties such as narrower particle size distributions and improved morphology. In one embodiment, the fuel composition comprising the improved collection of metal particles can be generated by applying an external EMF to a fuel regeneration solution. An improved regeneration solution can comprise an electrolyte, zincate ions and at least one non-zinc metal. Due to the presence of the non-zinc metal, and other additives, in the regeneration solution, the improved regeneration solution can be used to generate an improved fuel composition comprising a collection of particles having zinc and at least one non-zinc metal.Type: ApplicationFiled: September 12, 2003Publication date: March 18, 2004Inventors: Stuart I. Smedley, Guangwei Wu
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Patent number: D1007406Type: GrantFiled: May 20, 2022Date of Patent: December 12, 2023Inventors: Guie Fang, Guangwei Wu, Dandan Yang
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Patent number: D1007408Type: GrantFiled: May 19, 2022Date of Patent: December 12, 2023Inventors: Long Zhao, Dandan Yang, Guangwei Wu