Abstract: A flexible demolding device, comprising a flexible substrate and a driving device. A plurality of forming holes are provided on the flexible substrate and penetrate through the thickness direction of the flexible substrate. The driving device drives the flexible substrate to move continuously in a defined direction. The driving device comprises a driving wheel, a supporting wheel and a conveying belt which is sleeved between the driving wheel and the supporting wheel. The flexible substrate is fixed on the conveying belt. On one hand, the demolding assembly no longer has a rigid structure. On the other hand, since the flexible substrate can be fixed on the conveying belt by means of the connecting body, the flexible substrate can be easily replaced.

Abstract: A rigid demolding forming device, comprising a forming cylinder (11), a dispersing box (12), a suction box (13) and a forming fabric (14), wherein the forming cylinder (11) has a rigid structure; the dispersing box (12) is arranged in the forming cylinder (11); the forming fabric (14) is externally arranged; and an absorbent material moves from inside to outside. The forming fabric (14) and the forming cylinder (11) are arranged separately, such that the forming fabric (14) can be cleaned conveniently, thereby preventing fabric holes from being blocked. In addition, the forming fabric (14) and other devices are no longer arranged in a forming hole (114), such that when a core body (15) needs to be removed from the forming hole (114) after same is formed in the forming hole (114), product defects or the waste of absorbent materials, which are caused by an electrostatic effect or a viscous force effect of devices such as the forming fabric (14), can be avoided.

Abstract: A PCB adaptation for a solar lamp, characterized in that, at least one slot is set on the PCB, both sides of the slot comprises a pad, the pad connects to an inner circuit on the PCB, two leads of a leaded component is respectively soldered to the pad which is located on the both skies of the slot. By cutting a slot on the PCB in the present invention, auto surface-mount technology can be implemented to automatically solder the leaded component to the PCB. Low-cost leaded component and surface-mount technology are used in above technical solution, which can decrease the cost and increase the productivity and product quality.