Abstract: Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

Abstract: Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

Abstract: Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.

Abstract: The methods and compositions of this invention provide a means for determining the presence of Hepatitis C virus (HCV) in a sample from an individual. This is accomplished by hybridization to tissue samples using a cRNA probe that is specific for HCV. These means allow superior detection of HCV infection by virtue of the RNA riboprobe.

Abstract: An improved method for laser machining features in brittle materials 8 such as glass is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.

Abstract: An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.

Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

Abstract: A process to laser micro-machine a metal part with a high cosmetic quality surface, including applying a protective coating layer to at least one surface of the part to physically isolate the surface from air prior to micro-machining the part with a laser, and sacrificing the protective layer to block/consume oxygen in air by carbonization and oxidation due to strong laser irradiation. The protective coating applied to at least one of a front side high quality cosmetic surface and a back side surface of the part. The coating layer being highly transparent to an applied laser beam, having a thickness of between approximately 5 mil and approximately 10 mil, inclusive, and having sufficient adhesion strength to adhere to the part without delaminating during processing. The laser can be selected from a nano-second pulse width laser and a micro-second pulse width laser to process the part.

Abstract: A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape.