Patents by Inventor Guangyuan Cai

Guangyuan Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10773347
    Abstract: A dismantling mechanism with convex curved backplate and dismantling device for a display module are disclosed. The dismantling mechanism for the display module includes: a screen fixture configured to carry and secure a screen of the display module when dismantling the display module; a convex curved backplate arranged opposite to the screen fixture, configured to support a cover board of the display module when dismantling the display module; a moveable first dismantling structure configured to drive a first end of the cover board to move in a direction adjacent to the convex curved backplate when dismantling the display module; a first actuator connected with the first dismantling structure and configured to drive the first dismantling structure to move; and a second dismantling structure configured to at least partially support a second end of the cover board away from the first end when dismantling the display module.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: September 15, 2020
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.
    Inventors: Guangyuan Cai, Youhao Sun
  • Publication number: 20180117721
    Abstract: A dismantling mechanism and dismantling device for the display module are disclosed. The dismantling mechanism for the display module includes: a screen fixture configured to carry and secure a screen of the display module when dismantling the display module; a convex curved backplate arranged opposite to the screen fixture, configured to support a cover board of the display module when dismantling the display module; a moveable first dismantling structure configured to drive a first end of the cover board to move in a direction adjacent to the convex curved backplate when dismantling the display module; a first actuator connected with the first dismantling structure and configured to drive the first dismantling structure to move; and a second dismantling structure configured to at least partially support a second end of the cover board away from the first end when dismantling the display module.
    Type: Application
    Filed: October 12, 2017
    Publication date: May 3, 2018
    Inventors: Guangyuan Cai, Youhao Sun
  • Patent number: 9931742
    Abstract: An embodiment of the present invention provides a jig for detaching a display assembly. The display assembly comprises: a fixing module configured to fix a backlight module in the display assembly; and an absorbing module configured to absorb a display panel in the display assembly such that the display panel and the backlight module are separated from each other by an external force.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: April 3, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Gang Wang, Xinqing Zhu, Guangyuan Cai, Jianlei Yang, Yu Zhang, Ningheng Du
  • Patent number: 9881893
    Abstract: The present disclosure provides an apparatus for removing a chip, including: a loading station; a heating head arranged to soften an anisotropic conductive film on a substrate of a display panel for fixing the chip; a base table arranged on the loading station and arranged to support the display panel; and a base seat arranged on the loading station and arranged to support the heating head, wherein the heating head is rotatably mounted onto the base seat and the heating head has a rotation axis perpendicular to a surface of the loading station facing towards the base table. With the above apparatus, the face of the heating head facing towards the chip contacts with the face of the chip facing towards the heating head more sufficiently. The force to which the portion of the chip is subject is reduced and the force applied to the chip becomes more uniform.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: January 30, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Guangyuan Cai
  • Patent number: 9804427
    Abstract: A film-attaching apparatus comprising a base, a substrate bearing member configured to bear a substrate and a film bearing member configured to bear a film; the film bearing member is rotatable between a closed position and an open position; the film bearing member at the closed position has a bearing surface in opposite to that of the substrate bearing member such that a first portion of the film is contacted with a first portion of the substrate; and the substrate bearing member is movable in translational motion along a direction of the bearing surface of the substrate bearing member upon the film bearing member being at the closed position such that the bearing surfaces of the substrate bearing member and of the film bearing member are movable with respect to each other to attach a second portion of the film onto a second portion of the substrate.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: October 31, 2017
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.
    Inventors: Yu Zhang, Xinqing Zhu, Guangyuan Cai, Jianlei Yang, Yongkang Hou, Gang Wang
  • Publication number: 20170110433
    Abstract: The present disclosure provides an apparatus for removing a chip, including: a loading station; a heating head arranged to soften an anisotropic conductive film on a substrate of a display panel for fixing the chip; a base table arranged on the loading station and arranged to support the display panel; and a base seat arranged on the loading station and arranged to support the heating head, wherein the heating head is rotatably mounted onto the base seat and the heating head has a rotation axis perpendicular to a surface of the loading station facing towards the base table. With the above apparatus, the face of the heating head facing towards the chip contacts with the face of the chip facing towards the heating head more sufficiently. The force to which the portion of the chip is subject is reduced and the force applied to the chip becomes more uniform.
    Type: Application
    Filed: August 30, 2016
    Publication date: April 20, 2017
    Inventor: Guangyuan Cai
  • Publication number: 20160187678
    Abstract: A film-attaching apparatus comprising a base, a substrate bearing member configured to bear a substrate and a film bearing member configured to bear a film; the film bearing member is rotatable between a closed position and an open position; the film bearing member at the closed position has a bearing surface in opposite to that of the substrate bearing member such that a first portion of the film is contacted with a first portion of the substrate; and the substrate bearing member is movable in translational motion along a direction of the bearing surface of the substrate bearing member upon the film bearing member being at the closed position such that the bearing surfaces of the substrate bearing member and of the film bearing member are movable with respect to each other to attach a second portion of the film onto a second portion of the substrate.
    Type: Application
    Filed: September 22, 2015
    Publication date: June 30, 2016
    Applicants: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yu ZHANG, Xinqing ZHU, Guangyuan CAI, Jianlei YANG, Yongkang HOU, Gang WANG
  • Publication number: 20160074979
    Abstract: An embodiment of the present invention provides a jig for detaching a display assembly. The display assembly comprises: a fixing module configured to fix a backlight module in the display assembly; and an absorbing module configured to absorb a display panel in the display assembly such that the display panel and the backlight module are separated from each other by an external force.
    Type: Application
    Filed: June 19, 2015
    Publication date: March 17, 2016
    Inventors: Gang Wang, Xinqing Zhu, Guangyuan Cai, Jianlei Yang, Yu Zhang, Ningheng Du