Patents by Inventor Guanjian XU

Guanjian XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11302625
    Abstract: Disclosed are a radio frequency transistor for improving radio frequency switch performance, a chip and a mobile terminal. The radio frequency transistor comprises a first metal layer, a second metal layer, a polysilicon layer and an active area, the first metal layer being connected to the active area via contact holes, the first metal layer being connected to the second metal layer via through holes. The wiring direction of the second metal layer is perpendicular to the wiring direction of the polysilicon layer, thereby reducing parallel areas between the polysilicon layer and the first metal layer and decreasing the numbers of contact holes and through holes, so as to reduce the off capacitance. In addition, space saved by the first metal layer wiring and the contact holes is utilized, thereby increasing the channel width of the radio frequency transistor accommodated in a same chip area, and reducing the on-resistance.
    Type: Grant
    Filed: July 1, 2018
    Date of Patent: April 12, 2022
    Assignee: VANCHIP (TIANJIN) TECHNOLOGY CO., LTD.
    Inventors: Guanjian Xu, Yunfang Bai
  • Publication number: 20200194366
    Abstract: Disclosed are a radio frequency transistor for improving radio frequency switch performance, a chip and a mobile terminal. The radio frequency transistor comprises a first metal layer, a second metal layer, a polysilicon layer and an active area, the first metal layer being connected to the active area via contact holes, the first metal layer being connected to the second metal layer via through holes. The wiring direction of the second metal layer is perpendicular to the wiring direction of the polysilicon layer, thereby reducing parallel areas between the polysilicon layer and the first metal layer and decreasing the numbers of contact holes and through holes, so as to reduce the off capacitance. In addition, space saved by the first metal layer wiring and the contact holes is utilized, thereby increasing the channel width of the radio frequency transistor accommodated in a same chip area, and reducing the on-resistance.
    Type: Application
    Filed: July 1, 2018
    Publication date: June 18, 2020
    Applicant: VANCHIP (TIANJIN) TECHNOLOGY CO., LTD.
    Inventors: Guanjian XU, Yunfang BAI