Abstract: An optical receiver comprises a monolithically integrated pin photodiode (PIN) and transimpedance amplifier (TIA). The TIA comprises InP heterojunction bipolar transistors (HBT) fabricated from a first plurality of layers of an epitaxial layer stack grown on a SI:InP substrate; the PIN is fabricated from a second plurality of layers of the epitaxial layer stack. The p-contact of the PIN is directly connected to the input of the TIA to reduce PIN capacitance CPIN. The TIA capacitance CTIA may be matched to CPIN. Device parameters comprising: a thickness of the absorption layer, window area, and an optional mirror thickness of the PIN; device capacitance CPIN+CTIA; and feedback resistance RF of the TIA; are optimized to performance specifications comprising a specified sensitivity and responsivity at an operational wavelength. This design approach enables cost-effective fabrication an integrated PIN-TIA, for applications such as a 1577 nm receiver for an ONU for 10G-PON.

Abstract: Electro-absorption modulators (EAM) and monolithically integrated electro-absorption modulated lasers (EML) and methods of fabrication are disclosed. Vertically stacked waveguides for a distributed feedback (DFB) laser, an electro-absorption modulator (EAM) and a passive output waveguide are vertically integrated, and the DFB laser, EAM and output waveguide are optically coupled using laterally tapered vertical optical couplers. Laterally tapered vertical optical couplers provides an alternative to conventional butt-coupling of a laser and EAM, offering improved reliability for high power operation over extended lifetimes. Optionally, the EML comprises monolithically integrated electronic circuitry, e.g., driver and control electronics for the DFB laser and EAM. Beneficially, integrated EAM driver and control circuitry comprises a high-speed electro-optical control loop for very high-speed linearization and temperature compensation, e.g.

Abstract: An electro-optical module is provided in the form of a Ceramic Ball Grid Array (CBGA) optical package with a detachable fiber optic connector. The electro-optical module is surface mountable on a printed circuit boards (PCB) using standard electronics pick-and-place and reflow manufacturing technology. A module housing array of ultra-high-speed single mode fiber based optical transmit and/or receive devices provides for high density fiber interconnections and can be mounted directly on a PCB in close proximity to associated electronics. The resulting shorter electrical interconnects reduce losses and distortion of the high frequency electrical signals enabling lower power signals and lower error rates on the interfaces, for applications such as high-speed data center interconnects. Shorter electrical interconnects may also allow for simpler clock and data recovery circuits or, in some cases, complete elimination of some of these circuits.

Abstract: An electro-optical module is provided in the form of a Ceramic Ball Grid Array (CBGA) optical package with a detachable fiber optic connector. The electro-optical module is capable of being surface mounted on printed circuit boards using standard 5 electronics pick-and-place and reflow manufacturing technology. This package allows ultra-high-speed single mode fiber based optical transmit and receive devices to be mounted directly on Printed Circuit Boards (PCBs) in close proximity to their associated electronics. The resulting shorter electrical interconnects reduce losses and distortion of the high frequency electrical signals enabling lower power signals and lower error rates 10 on the interfaces, for applications such as high-speed data center interconnects. Shorter electrical interconnects may also allow for simpler clock and data recovery circuits or, in some cases, complete elimination of some of these circuits.

Abstract: An electro-absorption modulator (EAM) comprising an integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.

Abstract: An electro-absorption modulator (EAM) comprising an integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.

Abstract: An integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation of an electro-absorption modulator (EAM) for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.

Abstract: An integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation of an electro-absorption modulator (EAM) for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.

Abstract: Line interface for coupling a twisted pair telephone line with a communications network. The line interface includes a broadband analog front end for coupling the twisted pair telephone line with the line interface, and a programmable filter for filtering frequency bands to separate transmission channels, the transmission channels located in the communications network, wherein the frequency bands are determined by the programmable filter. In this manner, various services can be provided over the twisted pair telephone line.

Abstract: A system for providing at least one telephone service in a multiservice communication system, the system comprising a combiner for combining a plurality of services for delivery between a source and a user along a common line. A decombiner recovers the plurality of services from the common line, a detector detects a failure condition in at least one of the combiner or the decombiner, and a switch responsive to the detected failure bypasses the failed combiner or decombiner to couple at least one service determined to be critical between the source and the user. This allows an improved response to loss of power than many exiting systems.

Abstract: An integrated circuit having boundary-scan facilities in accordance with IEEE Standard 1149.1, has its boundary scan chain configured to permit fault insertion testing of diagnostic and maintenance software. Each Scan cell includes storage devices for storing a pair of bits of a binary vector shifted into the boundary scan chain. One bit comprises faulty data and the other bit serves to control application of the faulty data by the scan cell. A system incorporating such integrated circuits includes a controller for controlling the IEEE test interface to shift the binary vector into the boundary scan chain, and diagnostic and maintenance software for diagnosing the faults introduced into the integrated circuits.