Patents by Inventor Guem-Young Youn

Guem-Young Youn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead bonding method for SMD package
    Patent number: 6581820
    Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: June 24, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong-Sung Jung, Jong-Tae Kim, Guem-Young Youn, Chang-Dug Kim
  • Lead bonding method for SMD package
    Publication number: 20020179685
    Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.
    Type: Application
    Filed: July 27, 2001
    Publication date: December 5, 2002
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong-Sung Jung, Jong-Tae Kim, Guem-Young Youn, Chang-Dug Kim