Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

Abstract: A silicon membrane pressure sensor which has a carrier chip and a membrane chip 3 for which overload protection is desired to protect against the pressure on the front side of the membrane. An overload member 7 is mounted between the carrier chip 2 and the membrane chip 3 such that the overload member is connected to the membrane chip at a middle island portion 5 of the membrane chip 3 and with a first distance D1 from the carrier chip 2 in the non-loaded condition such that when pressure occurs the overload member will remove the load on the membrane chip.

Abstract: A method for generating patterned structures on a monolith substrate in micro-mechanics to permit the production of at least two successive structurings with the depths required in micro-mechanics. At least two different, selectively removable etching masks which are etchable by different etching agents are applied in sequence to the substrate. A first structuring or patterning step is then employed after the last etching mask has been generated. A further etching step occurs after the removal of the last etching mask through the use of the etching masks then remaining on the substrate. The removal of additional etching masks and generating further structuring steps are repeated until the number of etching steps that have been carried out is the same as the number of etching masks that had been originally present on the monolith substrate.