Abstract: An illuminating device includes: at least one lighting module, and at least one lighting module support, wherein the lighting module support is provided in order to dissipate heat from the lighting module and at least one first fastening element for fastening the lighting module on the lighting module support is provided, wherein the first fastening element is designed in such a way that the lighting module is pressed with a defined pressing force onto the lighting module support in such a way that a defined transfer of heat between the lighting module and lighting module support is enabled, and, in the region of the first fastening element, a movement of the lighting module, in particular a thermal expansion, parallel to the main plane of the lighting module is enabled.

Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

Abstract: A fastening element for fastening a light source substrate to a support. The fastening element is configured to be seated on the light source substrate, and includes at least one fastening portion for fastening to the support.

Abstract: A lighting device may include: a mount, which is populated with at least one electronic component and with at least one semiconductor light source, a cover for covering at least one electronic component and at least one connecting element for fastening the cover to the mount, wherein the connecting element is connected to the mount by means of a non-latching connection and to the cover by means of a latching connection.

Abstract: An LED module may include at least one LED, at least one first printed circuit board, on which the at least one LED is arranged, and a support element which is designed to support the at least one first printed circuit board. The support element is embodied as a heat pipe arrangement which includes at least one heat pipe.

Abstract: A lighting device (1; 21; 41) having at least one heat sink (5; 44) for cooling at least one light source, wherein the at least one heat sink (5; 44) comprises one or more at least bent sheet metal parts.

Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

Abstract: A lamp (1; 16; 20; 24; 30; 37; 39), at least comprising: a heat sink (2; 17; 21; 25), which bears at least one light source; (10) and an at least partially optically transmissive cover (11; 19; 23; 26) for the at least one light source (10), said cover being fastened to the heat sink (2; 17; 21; 25), the cover (11; 19; 23; 26; 31; 38; 40) having a wall thickness (d) which, at least sectionally, tapers as the distance from the heat sink (2; 17; 21; 25) increases.

Abstract: An illuminating device includes: at least one lighting module, and at least one lighting module support, wherein the lighting module support is provided in order to dissipate heat from the lighting module and at least one first fastening element for fastening the lighting module on the lighting module support is provided, wherein the first fastening element is designed in such a way that the lighting module is pressed with a defined pressing force onto the lighting module support in such a way that a defined transfer of heat between the lighting module and lighting module support is enabled, and, in the region of the first fastening element, a movement of the lighting module, in particular a thermal expansion, parallel to the main plane of the lighting module is enabled.

Abstract: A cooling element for a lighting device having a plurality of cooling fins, wherein adjacent cooling fins delimit a cooling fin intermediate space with at least one air duct for connecting at least two cooling fin intermediate spaces.

Abstract: A lighting device may include: a mount, which is populated with at least one electronic component and with at least one semiconductor light source, a cover for covering at least one electronic component and at least one connecting element for fastening the cover to the mount, wherein the connecting element is connected to the mount by means of a non-latching connection and to the cover by means of a latching connection.

Abstract: A lighting device, having at least one light outlet opening and at least two different fixing interfaces for the optional fixing of a respective attachment element optically upstream of the at least one light outlet opening.

Abstract: In various embodiments, a lamp is provided. The lamp may include at least one solid light source which is installed on a carrier; an at least partially light-permeable vessel, which encloses the light source and the carrier in a gas-tight manner and a filling gas, which is enclosed in the vessel, wherein the filling gas is a mixture of at least one gas having high thermal conductivity and at least one gas having a different physical property.

Abstract: A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.

Abstract: In various embodiments, a semiconductor lamp may include at least one semiconductor light source; a driver for operating the at least one semiconductor light source and at least one heat sink for cooling the at least one semiconductor light source and the driver; wherein the at least one heat sink may include a first heat sink, which is thermally connected to the at least one semiconductor light source and a second heat sink, which is thermally connected to the driver; wherein the first heat sink and the second heat sink are thermally insulated from one another.

Abstract: A fastening element for fastening a light source substrate to a support, wherein the fastening element is configured to be seated on the light source substrate, and includes at least one fastening means for fastening to the support.

Abstract: A heat sink may be constructed from at least one sheet-metal part and may include at least one flow structure, wherein the flow structure is configured to guide cooling air along an inner side of the heat sink, and wherein the flow structure is configured to direct the cooling air at least partially along a longitudinal axis of the heat sink on the inner side of the heat sink.

Abstract: In various embodiments, a semiconductor lamp may include a driver cavity for accommodating driver electronics, and a light source substrate populated with at least one semiconductor light source, said driver cavity being closed by the light source substrate.

Abstract: In various embodiments, a semiconductor lamp may include at least one semiconductor light source; a driver for operating the at least one semiconductor light source and at least one heat sink for cooling the at least one semiconductor light source and the driver; wherein the at least one heat sink may include a first heat sink, which is thermally connected to the at least one semiconductor light source and a second heat sink, which is thermally connected to the driver; wherein the first heat sink and the second heat sink are thermally insulated from one another.

Abstract: In various embodiments, a lamp is provided. The lamp may include at least one solid light source which is installed on a carrier; an at least partially light-permeable vessel, which encloses the light source and the carrier in a gas-tight manner and a filling gas, which is enclosed in the vessel, wherein the filling gas is a mixture of at least one gas having high thermal conductivity and at least one gas having a different physical property.