Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

Abstract: A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.

Abstract: A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.

Abstract: A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.

Abstract: A semiconductor component has one or more semiconductor chips with contact pads, a number of substrate layers, component contacts and conductor tracks which establish the electrical connection between the contact pads of the semiconductor chip and the component contacts. The substrate layers are respectively provided with conductor tracks and at least one opening and the chip or chips are placed in the opening. A plurality of substrate layers are interconnected lying above one another. The conductor tracks of respective substrate layers end in an area in the vicinity of the at least one semiconductor chip and in an edge area of the respective substrate layer.