Patents by Inventor Guenter TUTSCH

Guenter TUTSCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package with cross-linked thermoplastic dielectric
    Patent number: 10854547
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: December 1, 2020
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Georg Meyer-Berg, Guenter Tutsch
  • CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE
    Publication number: 20190287907
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.
    Type: Application
    Filed: February 19, 2019
    Publication date: September 19, 2019
    Applicant: Infineon Technologies AG
    Inventors: Joachim Mahler, Georg Meyer-Berg, Guenter Tutsch
  • Chip packages and methods for manufacturing a chip package
    Patent number: 9666452
    Abstract: A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: May 30, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Karl Adolf Dieter Mayer, Guenter Tutsch, Horst Theuss, Manfred Engelhardt, Joachim Mahler
  • CHIP PACKAGES AND METHODS FOR MANUFACTURING A CHIP PACKAGE
    Publication number: 20130313719
    Abstract: A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.
    Type: Application
    Filed: May 25, 2012
    Publication date: November 28, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Karl Adolf Dieter MAYER, Guenter TUTSCH, Horst THEUSS, Manfred ENGELHARDT, Joachim MAHLER