Patents by Inventor Guenther Aichmayr

Guenther Aichmayr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits, micromechanical devices, and method of making same
    Patent number: 7935634
    Abstract: A method of making an integrated circuit comprises providing a substrate and forming a structure on the substrate comprising a first enclosed portion of a carbon material and a second portion of the carbon material, wherein an intersection of the first and second portion of the carbon material has a defined dimension. The method further comprises processing the substrate with a plasma comprising hydrogen in order to etch the second portion of the carbon material, wherein the defined dimension of the intersection of the first and second portion of the carbon material substantially suppresses etching of the first enclosed portion of the carbon material in a self-limiting way.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: May 3, 2011
    Assignee: Qimonda AG
    Inventors: Maik Liebau, Thomas Betzl, Olaf Storbeck, Georg Duesberg, Guenther Aichmayr
  • INTEGRATED CIRCUITS, MICROMECHANICAL DEVICES, AND METHOD OF MAKING SAME
    Publication number: 20090045161
    Abstract: A method of making an integrated circuit comprises providing a substrate and forming a structure on the substrate comprising a first enclosed portion of a carbon material and a second portion of the carbon material, wherein an intersection of the first and second portion of the carbon material has a defined dimension. The method further comprises processing the substrate with a plasma comprising hydrogen in order to etch the second portion of the carbon material, wherein the defined dimension of the intersection of the first and second portion of the carbon material substantially suppresses etching of the first enclosed portion of the carbon material in a self-limiting way.
    Type: Application
    Filed: August 16, 2007
    Publication date: February 19, 2009
    Inventors: Maik Liebau, Thomas Betzl, Olaf Storbeck, Georg Duesberg, Guenther Aichmayr
  • Manufacturing method for a trench capacitor having an isolation collar electrically connected with a substrate on a single side via a buried contact for use in a semiconductor memory cell
    Patent number: 7312114
    Abstract: The present invention relates to a manufacturing method for a trench capacitor having an isolation collar which is electrically connected with a substrate on a single side via a buried contact. More specifically, the present invention relates to manufacturing method for a trench capacitor having an isolation collar with a metal conductive fill in the collar region connected to a metal fill in the capacitor region.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: December 25, 2007
    Assignee: Infineon Technologies AG
    Inventors: Stephan Kudelka, Guenther Aichmayr
  • Manufacturing method for a trench capacitor having an isolation collar electrically connected with a substrate on a single side via a buried contact for use in a semiconductor memory cell
    Publication number: 20060246656
    Abstract: The present invention relates to a manufacturing method for a trench capacitor having an isolation collar which is electrically connected with a substrate on a single side via a buried contact, particularly for use in a semiconductor memory cell. More specifically, the present invention relates to a manufacturing method for a trench capacitor having an isolation collar with a metal conductive fill in the collar region connected to a metal fill in the capacitor region.
    Type: Application
    Filed: April 27, 2005
    Publication date: November 2, 2006
    Applicant: Infineon Technologies AG
    Inventors: Stephan Kudelka, Guenther Aichmayr