Abstract: A projection exposure apparatus for microlithography, in particular an EUV projection exposure apparatus, having a beam path along which propagates electromagnetic radiation with which the projection exposure apparatus is operated, and having at least one filter (55) arranged in the beam path, wherein the projection exposure apparatus furthermore comprises at least one sensor device for monitoring the filter, wherein at least one blocking element (60) is provided which is movable between a standby position and a bather position, and wherein the movement of the blocking element can be effected at least in a manner dependent on a signal of the sensor device. An associated method for operating an apparatus of this type is also disclosed.

Abstract: A method for cooling an optical element for EUV applications is disclosed. Heat is transferred from the optical element to a heat sink, and, via a first feed line, a first cooling medium is introduced into a cooling channel in the heat sink, in such a way that the first cooling medium effects laminar flow through the cooling channel and in the process absorbs heat from the heat sink. After flowing through the cooling channel, the first cooling medium is discharged into a discharge line leading away from the optical element. A second cooling medium is introduced into the discharge line via a second feed line, and the first cooling medium and the second cooling medium, downstream of the second feed line at a location that is further away from the optical element than the cooling channel, are subjected to a force field introduced into the discharge line externally.

Abstract: A projection exposure apparatus for microlithography, in particular an EUV projection exposure apparatus, having a beam path along which propagates electromagnetic radiation with which the projection exposure apparatus is operated, and having at least one filter (55) arranged in the beam path, wherein the projection exposure apparatus furthermore comprises at least one sensor device for monitoring the filter, wherein at least one blocking element (60) is provided which is movable between a standby position and a bather position, and wherein the movement of the blocking element can be effected at least in a manner dependent on a signal of the sensor device. An associated method for operating an apparatus of this type is also disclosed.

Abstract: An optical arrangement, in particular in a projection exposure apparatus for EUV lithography. In an aspect an optical arrangement has a housing (100, 200, 550, 780) in which at least one optical element is arranged, and at least one subhousing (140, 240, 560, 790, 811, 823, 824, 831, 841) which is arranged within the housing and which surrounds at least one beam incident on the optical element in operation of the optical system, wherein the internal space of the subhousing is in communication with the external space of the subhousing by way of at least one opening, wherein provided in the region of the opening is at least one flow guide portion which deflects a flushing gas flow passing through the opening from the internal space to the external space of the subhousing, at least once in its direction.

Abstract: A method for cooling an optical element for EUV applications is disclosed. Heat is transferred from the optical element to a heat sink, and, via a first feed line, a first cooling medium is introduced into a cooling channel in the heat sink, in such a way that the first cooling medium effects laminar flow through the cooling channel and in the process absorbs heat from the heat sink. After flowing through the cooling channel, the first cooling medium is discharged into a discharge line leading away from the optical element. A second cooling medium is introduced into the discharge line via a second feed line, and the first cooling medium and the second cooling medium, downstream of the second feed line at a location that is further away from the optical element than the cooling channel, are subjected to a force field introduced into the discharge line externally.

Abstract: A mirror with a mirror carrier, as well as related apparatuses, systems and methods are disclosed. The mirror carrier can be embodied as cooling device with at least one cooling channel. Tube connections can be provided to connecting the at least one cooling channel to an inlet and an outlet of coolant. Sealing elements for a gas-tight and liquid-tight seals can be arranged between the tube connections and the mirror carrier. The field of application of the mirror can be, for example, an illumination device of a projection exposure apparatus.

Abstract: The disclosure relates to microlithography systems, such as EUV micro-lithography illumination systems, as well as related components, systems and methods.

Abstract: An optical arrangement, in particular in a projection exposure apparatus for EUV lithography. In an aspect an optical arrangement has a housing (100, 200, 550, 780) in which at least one optical element is arranged, and at least one subhousing (140, 240, 560, 790, 811, 823, 824, 831, 841) which is arranged within the housing and which surrounds at least one beam incident on the optical element in operation of the optical system, wherein the internal space of the subhousing is in communication with the external space of the subhousing by way of at least one opening, wherein provided in the region of the opening is at least one flow guide portion which deflects a flushing gas flow passing through the opening from the internal space to the external space of the subhousing, at least once in its direction.

Abstract: The disclosure relates to microlithography systems, such as EUV micro-lithography illumination systems, as well as related components, systems and methods.

Abstract: An illumination optics for EUV microlithography illuminates an object field with the aid of an EUV used radiation beam. Preset devices preset illumination parameters. An illumination correction device corrects the intensity distribution and/or the angular distribution of the object field illumination. The latter has an optical component to which the used radiation beam is at least partially applied upstream of the object field and which can be driven in a controlled manner. A detector acquires one of the illumination parameters. An evaluation device evaluates the detector data and converts the latter into control signals. At least one actuator displaces the optical component. During exposures, the actuators are controlled with the aid of the detector signals during the period of a projection exposure. A maximum displacement of below 8 ?m is ensured for edges of the object field towards an object to be exposed.

Abstract: The disclosure relates to microlithography systems, such as EUV microlithography illumination systems, as well as related components, systems and methods.

Abstract: Illumination optics that can be used, for example, for EUV projection microlithography are disclosed. Also disclosed are illumination systems provided with such illumination optics, projection exposure apparatuses provided with such illumination systems, related methods of manufacturing microstructured elements, and microstructured elements obtained by these methods.

Abstract: The disclosure relates to methods for producing mirrors, in particular facet mirrors, and projection exposure apparatuses equipped with the mirrors.

Abstract: The invention relates to an apparatus for the manipulation and/or adjustment of an optical element with respect to a structure, the optical element being connected to the structure by means of a number of setting members, and the setting members having as active adjusting elements screw elements or piezoceramic elements, which in each case produce an active force along one degree of freedom and by means of which the optical element is connected to the structure in such a way that it can be set in up to six degrees of freedom.

Abstract: A facet mirror is provided with a multiplicity of mirror segments (11) which have reflective surfaces (13). A number of mirror segments (11) are in each case arranged on a mirror carrier (9). At least a part of the mirror segments (11) has an aspect ratio of greater than 1:5, is identically arranged and accommodated individually in a holder (10).

Abstract: The disclosure relates to microlithography systems, such as EUV microlithography illumination systems, as well as related components, systems and methods.

Abstract: A mirror with a mirror carrier, as well as related apparatuses, systems and methods are disclosed. The mirror carrier can be embodied as cooling device with at least one cooling channel. Tube connections can be provided to connecting the at least one cooling channel to an inlet and an outlet of coolant. Sealing elements for a gas-tight and liquid-tight seals can be arranged between the tube connections and the mirror carrier. The field of application of the mirror can be, for example, an illumination device of a projection exposure apparatus.

Abstract: Illumination optics that can be used, for example, for EUV projection microlithography are disclosed. Also disclosed are illumination systems provided with such illumination optics, projection exposure apparatuses provided with such illumination systems, related methods of manufacturing microstructured elements, and microstructured elements obtained by these methods.