Abstract: A temperature adjustment system for adjusting a temperature of a DUT electrically connected to a socket includes a first temperature adjustment device that supplies a fluid to an internal space in either the socket or a contact member that contacts the DUT when the DUT is pressed against the socket and a second temperature adjustment device that adjusts a temperature of an atmosphere in a chamber in which the socket and the contact member are disposed. The first temperature adjustment device includes a first supplier that supplies a first fluid and includes one or more connectors connected to one or more supply sources that supply the first fluid and a heat exchanger disposed between the one or more connectors and the internal space. The heat exchanger has a heat exchange part exposed in the chamber and exchanges heat between the first fluid and the atmosphere in the chamber.

Abstract: An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer.

Abstract: An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer.