Abstract: Embodiments are disclosed for a system for coupling with at least one vehicle cable for communication with components of an infotainment system. In one example, the system includes a housing and a domain controller with hardware components enclosed within the housing. The system may further include a first connector interface arranged at a first side of the housing, the first connector interface including all connections for the domain controller.

Abstract: Embodiments are disclosed for a standardized car interface for cockpit controllers in vehicles. In one example, a system for coupling a vehicle cable for communication with components of an infotainment system, comprises: a housing, a domain controller, and a first connector interface including all connections for the domain controller. In the event that a first domain controller is exchanged for a second domain controller, a collection of user preferences may be transferred between the first domain controller to the second domain controller.

Abstract: A generic domain compute system that is customizable for at least one domain or zone compute in a vehicle having a gateway power and control (GAPAC). The GAPAC has a power supply, a scalable microcontroller, a power management integrated circuit, a set of standardized and scalable external connectors for external inter-connections for Ethernet and car connector, a standard and scalable internal connector for internal inter-connections for power, control and generic busses. At least a first compute extension (COMEX) has a standard and scalable connecter internally connected to the GAPAC. The COMEX has a scalable microcontroller, a power management integrated circuit and a set of standardized and scalable connectors for external inter-connections. The COMEX is supplied with a permanent voltage from the GAPAC power supply. The microcontrollers, external connectors and internal connectors are scaled according to the domain or zone compute application.

Abstract: An in-vehicle control device a mainboard with at least one connection exposed at a first panel of a housing. One or more connectors in a second panel of the housing are interconnected with the mainboard and accessible from outside the housing for connecting the mainboard to a vehicle system. A mounting frame cooperates with the housing at the first panel of the housing exposing the connection to the mainboard, and at least one interchangeable node, computing node and/or connectivity node, is detachably connected to the mounting frame. The at least one interchangeable node has a connector for connecting to the mainboard, and at least one System-on-a-Chip (SoC) having scalable performance capabilities, or a high-performance antenna.

Abstract: Examples are disclosed for in-vehicle systems and methods of allocating local and remote hardware computing resources. An example system for controlling a vehicle includes a first computing device physically positioned in the vehicle, a second computing device positioned away from the vehicle, and an elastic computing module communicatively coupled to the first computing device and the second computing device, the elastic computing module configured to: determine computing and memory capacities of the first computing device and the second computing device; determine software demands of a software application for controlling a component of the vehicle; and dynamically allocate processing of the software application to the first computing device and/or the second computing device based on the computing and memory capacities of the first and second computing devices and the software demands of the software application.

Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

Abstract: A vehicle computing system includes a vehicle computing module mounted on a main system board. The module includes a computing module circuit board with computing components mounted thereon including a central processing unit and a main memory. An edge connector connects the computing module circuit board to an edge connector socket on the main system board. A plurality of computing function interfaces are connected to the edge connector, and include a configuration interface connected to the central processing unit and, via the edge connector, to a controller on the main system board. The controller configures the central processing unit for operation in the vehicle computing system by enabling specification of the computing function interfaces during a vehicle computing module configuration. The computing function interfaces are configured during the vehicle computing module configuration to process data received by the vehicle computing module via the computing function interfaces.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

Abstract: An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer.

Abstract: A vehicle computing system includes a vehicle computing module mounted on a main system board. The module includes a computing module circuit board with computing components mounted thereon including a central processing unit and a main memory. An edge connector connects the computing module circuit board to an edge connector socket on the main system board. A plurality of computing function interfaces are connected to the edge connector, and include a configuration interface connected to the central processing unit and, via the edge connector, to a controller on the main system board. The controller configures the central processing unit for operation in the vehicle computing system by enabling specification of the computing function interfaces during a vehicle computing module configuration. The computing function interfaces are configured during the vehicle computing module configuration to process data received by the vehicle computing module via the computing function interfaces.

Abstract: A vehicle computing system includes a vehicle computing module mounted on a main system board. The module includes a computing module circuit board with computing components mounted thereon including a central processing unit and a main memory. An edge connector connects the computing module circuit board to an edge connector socket on the main system board. A plurality of computing function interfaces are connected to the edge connector, and include a configuration interface connected to the central processing unit and, via the edge connector, to a controller on the main system board. The controller configures the central processing unit for operation in the vehicle computing system by enabling specification of the computing function interfaces during a vehicle computing module configuration. The computing function interfaces are configured during the vehicle computing module configuration to process data received by the vehicle computing module via the computing function interfaces.

Abstract: An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: A computing device is provided that includes a computing unit, which has a working memory and a processing unit, and a boot memory having control instructions for operating the computing device. The control instructions are stored in boot memory and are to be transferred to the computing unit at start-up of the computing device. A boot control unit is connected to the computing unit by at least a first and a second interface and connected to the boot memory by a third interface. The boot control unit is configured to transfer a first part of the control instructions from the boot memory via the first interface to the computing unit and to transfer a second part of the control instructions from the boot memory via the second interface to the computing unit.

Abstract: A vehicle computing system is provided that includes a vehicle computing module mounted on a main system board. The vehicle computing module includes a computing module circuit board with conducting paths. Computing components are mounted to the computing module circuit board and include at least a central processing unit and a main memory. An edge connector is provided at an edge of the computing module circuit board and adapted to connect the computing module circuit board to an edge connector socket on the main system board. A plurality of computing function interfaces are connected to the edge connector. The plurality of computing function interfaces includes a configuration interface connected to the central processing unit and, via the edge connector, to a controller on the main system board.

Abstract: A computing device is provided that includes a computing unit, which has a working memory and a processing unit, and a boot memory having control instructions for operating the computing device. The control instructions are stored in boot memory and are to be transferred to the computing unit at start-up of the computing device. A boot control unit is connected to the computing unit by at least a first and a second interface and connected to the boot memory by a third interface. The boot control unit is configured to transfer a first part of the control instructions from the boot memory via the first interface to the computing unit and to transfer a second part of the control instructions from the boot memory via the second interface to the computing unit.