Abstract: A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules.

Abstract: A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.

Abstract: An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass.

Abstract: A method for hermetically fastening a glass fiber within a tube, wherein the tube can be used with light wave guide components, the tube serving as a connecting part at the component. The method provides for a tube consisting of quartz, quartz glass or glass. The glass fiber is connected to the tube at a predetermined fastening location by means of heating the tube and collapsing the tube to hermetically connect the glass fiber to the tube through melting.

Abstract: A useful current component of an electro-optical coupling element is increased by providing a synthetic resin coupling medium having an adhered unitary encapsuling mass composed of the identical synthetic resin forming the coupling medium and containing therein a radiation reflecting material, such as titanium dioxide and a radiation impermeable material, such as aluminum bronze.