Patents by Inventor Guh-Hwan LIM

Guh-Hwan LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11903129
    Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
  • Publication number: 20230199976
    Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.
    Type: Application
    Filed: April 22, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Guh Hwan LIM, Chi Seong KIM, Won Seok LEE, Jin Oh PARK, Yu Mi KIM, Sang Yun LEE, Eun Sun KIM
  • Publication number: 20230141270
    Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
    Type: Application
    Filed: March 10, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
  • Patent number: 10217551
    Abstract: A magnetic sheet having a magnetic material particle comprising a hexaferrite and a nanofiber matrix made of two or more nanofibers, wherein the magnetic material particle is dispersed in the nanofiber matrix. A manufacturing method thereof and a speaker including the magnetic sheet are also provided.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: February 26, 2019
    Assignees: Samsung Electronics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Sang-Eui Lee, Byungkwon Lim, Kyoung-Seok Moon, In Taek Han, Jin Kyu Kang, Jin Ho Ahn, Nayoung Kwon, Shingyu Bok, Hwansu Sim, Jooyoung Lee, Guh-Hwan Lim
  • Publication number: 20170178771
    Abstract: A magnetic sheet having a magnetic material particle comprising a hexaferrite and a nanofiber matrix made of two or more nanofibers, wherein the magnetic material particle is dispersed in the nanofiber matrix. A manufacturing method thereof and a speaker including the magnetic sheet are also provided.
    Type: Application
    Filed: June 23, 2016
    Publication date: June 22, 2017
    Inventors: Sang-Eui LEE, Byungkwon LIM, Kyoung-Seok MOON, In Taek HAN, Jin Kyu KANG, Jin Ho AHN, Nayoung KWON, Shingyu BOK, Hwansu SIM, Jooyoung LEE, Guh-Hwan LIM