Abstract: A method for remotely shutting down a downhole unit of a rotary steering system from ground includes steps of: a: calculating a pressure difference P1 between a front end and a rear end of the drill water hole; b: calculating an extension loss ?P; c: calculating a pressure P2 at the riser after turning on the downlink device; d: calculating an opening area S1 of the throttle valve of the downlink device; and e: adjusting the throttle valve to a calculated opening degree; automatically targeting the function block that needs to be cut off according to a flow change detected downhole, and shutting down the downhole unit. The method can realize self-protection and continuous operation of the entire rotary steering system, reduce frequency of inspection that needs to pull back the drill when the rotary steering system is abnormal, improve drilling efficiency, and reduce costs.

Abstract: A data partition storage system is provided. The system includes: a data analysis device, configured to determine, according to a data feature of target data comprised in a database, a heat level corresponding to the target data; and a database kernel, deployed on a target device different from the data analysis device to form the database, and configured to: acquire the heat level corresponding to the target data transmitted by the data analysis device; and store the target data in a storage area corresponding to the heat level.

Abstract: A multimedia processing method includes: obtaining, in response to an editing operation for a multimedia file, a material editing mode and an interaction template corresponding to a type of a material in the multimedia file; identifying the material in the multimedia file according to the material editing mode, and applying the interaction template to the identified material; and displaying the multimedia file after the interaction template is applied.

Abstract: A data processing method including: acquiring information of multiple first data blocks of a first level to be merged and information of multiple second data blocks of a second level to be merged, wherein each of the first data blocks of the first level has the same first size, and each of the second data blocks of the second level has the same second size; performing, according to the information of the multiple first data blocks and the information of the multiple second data blocks, data comparison on each of the first data blocks and each of the second data blocks; and performing, according to a comparison result, data compaction on the first level and the second level. The embodiments of the present disclosure effectively reduce system overheads caused by I/O data read and write and data comparison, thereby improving the system throughput.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: The present application describes techniques for managing primary and secondary databases. One example method includes determining whether a lock held by a primary database expires, wherein the primary database and the secondary databases share the lock; in response to determining that the lock held by the primary database has expired, determining whether a lock renewal request of the primary database has been received; and in response to determining that the lock renewal request of the primary database has not been received, selecting a particular secondary database from the secondary databases as a new primary database, and controlling the primary database to be switched to the particular secondary database.

Abstract: The present application describes techniques for managing primary and secondary databases. One example method includes determining whether a lock held by a primary database expires, wherein the primary database and the secondary databases share the lock; in response to determining that the lock held by the primary database has expired, determining whether a lock renewal request of the primary database has been received; and in response to determining that the lock renewal request of the primary database has not been received, selecting a particular secondary database from the secondary databases as a new primary database, and controlling the primary database to be switched to the particular secondary database.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: A detaching apparatus includes a bench, a first supporting member attached to the bench, a convey system, a positioning member, a second supporting member, and a detaching member. The convey system is attached to the first supporting member for conveying a circuit board. The positioning member is attached to the first supporting member for positioning the circuit board. The second supporting member is attached to the bench and aligning with the first supporting member. The detaching member is attached to the second supporting member and includes a sliding bracket moving vertically relative to the bench, a moving block moving horizontally in the sliding bracket, a blade attached to the moving block, and a vacuum suction cup attached to the moving block and aligning with the blade.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: An apparatus for removing cables is provided. The apparatus includes a worktable. An upper surface of the worktable is used to fix at least one motherboard separately. Each motherboard includes a cable fixed thereon. The apparatus includes a feeding assembly, a driving assembly and a removing assembly. The driving assembly and the removing assembly are located on the feeding assembly. The feeding assembly is used to drive the driving assembly and the removing assembly to move to a pre-defined position. The driving assembly is used to drive the removing assembly to remove the cable from the motherboard.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: An apparatus for removing cables is provided. The apparatus includes a worktable. An upper surface of the worktable is used to fix at least one motherboard separately. Each motherboard includes a cable fixed thereon. The apparatus includes a feeding assembly, a driving assembly and a removing assembly. The driving assembly and the removing assembly are located on the feeding assembly. The feeding assembly is used to drive the driving assembly and the removing assembly to move to a pre-defined position. The driving assembly is used to drive the removing assembly to remove the cable from the motherboard.

Abstract: A detaching apparatus includes a bench, a first supporting member attached to the bench, a convey system, a positioning member, a second supporting member, and a detaching member. The convey system is attached to the first supporting member for conveying a circuit board. The positioning member is attached to the first supporting member for positioning the circuit board. The second supporting member is attached to the bench and aligning with the first supporting member. The detaching member is attached to the second supporting member and includes a sliding bracket moving vertically relative to the bench, a moving block moving horizontally in the sliding bracket, a blade attached to the moving block, and a vacuum suction cup attached to the moving block and aligning with the blade.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.

Abstract: A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.

Abstract: An LED lamp includes a heat sink including a base and a plurality of fins extending from the base, an LED module mounted on a bottom face of the base, an envelope covering the LED module, and a lamp housing defining a cavity. An annular receiving groove is recessed from the bottom face of the base. The LED module is attached on the bottom face of the base and surrounded by the receiving groove. The envelope includes a recessed body and an engaging flange around the recessed body. The heat sink, the LED module and the envelope are received in the cavity. The fins of the heat sink extend outwardly through the lamp housing and are exposed in an outer environment. A gasket is received in the receiving groove and tightly sandwiched between the base and the flange.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: An LED lamp includes a heat sink and a plurality of LED modules. The heat sink includes a base and a plurality of supporters extending from a top face of the base. Each supporter has an inclined supporting face facing an adjacent one of two opposite lateral sides of the base. Each LED module is mounted on an inclined supporting face of a corresponding supporter. The supporters have extending heights gradually increasing along a horizontal direction from the two opposite lateral sides toward a center of the base. Angles between the base and the supporting faces of the supporters are acute angles and gradually decrease along the horizontal direction from the two opposite lateral sides toward the center of the base.