Patents by Inventor Gui Hyun CHO

Gui Hyun CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Load cup and chemical mechanical polishing apparatus and method of manufacturing including the same
    Patent number: 11027394
    Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: June 8, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jieun Yang, Dong-il Yoon, Taemin Earmme, Gui Hyun Cho, Seok Heo, Jong Hwi Seo, Yong Won Choi
  • LOAD CUP AND CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF MANUFACTURING INCLUDING THE SAME
    Publication number: 20190176291
    Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.
    Type: Application
    Filed: June 28, 2018
    Publication date: June 13, 2019
    Inventors: Jieun YANG, Dong-il YOON, Taemin EARMME, Gui Hyun CHO, Seok HEO, Jong Hwi SEO, Yong Won CHOI