Abstract: A solution supplying unit includes a body, a first supplying tube and a second supplying tube. The body includes a chamber having a substantially circular cross-section to receive a solution and an out-flowing part connected to the chamber to flow out the solution. The first supplying tube is disposed at a side of the body, tangentially connected to the chamber, and supplying a first solution into the chamber to rotate the first solution in the chamber. The second supplying tube has an end portion, and supplying a second solution into the chamber to mix the first solution with the second solution. The end portion is formed through the body and is adjacent to a central axis of the body.

Abstract: A solution supplying unit includes a body, a first supplying tube and a second supplying tube. The body includes a chamber having a substantially circular cross-section to receive a solution and an out-flowing part connected to the chamber to flow out the solution. The first supplying tube is disposed at a side of the body, tangentially connected to the chamber, and supplying a first solution into the chamber to rotate the first solution in the chamber. The second supplying tube has an end portion, and supplying a second solution into the chamber to mix the first solution with the second solution. The end portion is formed through the body and is adjacent to a central axis of the body.

Abstract: Provided are an apparatus for cleaning a substrate by dipping the substrate in a treating bath filled with a treating solution and a method for cleaning a substrate using the apparatus. A boat provided to each of the treating baths supports the substrate by being in contact with a different point of a substrate during a process. Contact points of the substrate which each of the boats supports are made different at every treating bath, so that contact points of a substrate which are not cleaned in any treating bath can be cleaned in different treating baths. Therefore, an efficiency of a cleaning process is improved.

Abstract: Provided are a method for treating a process solution and an apparatus for treating a substrate using the same. The apparatus includes a treating bath, a circulating line, a bypass line, and a filter. A process solution for a substrate is provided in the treating bath. The circulating line is connected to the treating bath, and the process solution circulates through the circulating line. The bypass line branches from a first position of the circulating line and couples at a second position of the circulating line. The filter is installed in a position of the circulating line between the first position and the second position.