Abstract: This application provides a system-in package component, an electronic device, and a system-in package component manufacturing method, to improve compatibility flexibility of a PCB with a component, reduce an area of the PCB, and reduce costs of the PCB. The system-in package component includes: a first carrier board; a plurality of electronic components, separately disposed on the first carrier board, where the first carrier board is configured to implement an electrical connection between at least two electronic components of the plurality of electronic components, and at least one electronic component of the plurality of electronic components includes a packaged integrated circuit; and a packaging material, configured to package the plurality of electronic components on the first carrier board.

Abstract: A method and an apparatus for reading and writing data are disclosed. The method includes: storing a request in a bank queue; comparing weight values of different banks in the bank queue, wherein the different banks comply with a time sequence parameter; and scheduling the bank queue according to the comparison result. With the embodiments of the present invention, the operation sequence may be optimized, and the buffer efficiency may be greatly improved.