Abstract: The invention relates to a lamellar separator for separating liquid droplets from a liquid-charged fluid, having at least two essentially vertically oriented lamellar profiles, which are spaced apart from one another, and which form a flow channel between them for conducting through the liquid-charged fluid and on the wall surfaces of which the liquid droplets are separated, and having a catch basin situated below the lamellar profiles for receiving the liquid separated from the liquid-charged fluid, the catch basin having at least one partition wall, which divides the catch basin into multiple areas.

Abstract: The invention relates to an apparatus and a method for reheating turbine steam, comprising a reheater and a condensate collecting tank, into which condensate is guided from the reheater. A subcooler is provided upstream of the reheater in a common housing with the reheater. The subcooler is arranged beneath the reheater and the condensate collecting tank is connected with the subcooler in order to supply condensate from the condensate collecting tank as heating medium.

Abstract: The invention relates to a lamellar separator for separating liquid droplets from a liquid-charged fluid, having at least two essentially vertically oriented lamellar profiles, which are spaced apart from one another, and which form a flow channel between them for conducting through the liquid-charged fluid and on the wall surfaces of which the liquid droplets are separated, and having a catch basin situated below the lamellar profiles for receiving the liquid separated from the liquid-charged fluid, the catch basin having at least one partition wall, which divides the catch basin into multiple areas.

Abstract: In a diode laser module and a method for the production thereof, there is a need to fix the optical elements required for collimating, beam shaping and/or beam rearrangement of the radiation of a laser diode element with high reproducibility and long-term stability in an optically aligned manner, wherein the optically aligned state is produced by a successive adjustment of the optical elements in the beam of the switched-on laser diode element. It must be ensured that the fixing can be carried out in a process that is at least partially automated. At least one intermediate carrier is arranged on a heat-dissipating carrier serving to cool the laser diode element. The heat conductivity of the intermediate carrier is less than that of the heat-dissipating carrier, and the alignment of the optical components and fixation by sequential soldering is carried out on the surface of the intermediate carrier.

Abstract: In a diode laser module and a method for the production thereof, there is a need to fix the optical elements required for collimating, beam shaping and/or beam rearrangement of the radiation of a laser diode element with high reproducibility and long-term stability in an optically aligned manner, wherein the optically aligned state is produced by a successive adjustment of the optical elements in the beam of the switched-on laser diode element. It must be ensured that the fixing can be carried out in a process that is at least partially automated. At least one intermediate carrier is arranged on a heat-dissipating carrier serving to cool the laser diode element. The heat conductivity of the intermediate carrier is less than that of the heat-dissipating carrier, and the alignment of the optical components and fixation by sequential soldering is carried out on the surface of the intermediate carrier.

Abstract: The invention refers to a novel semiconductor module with at least one semiconductor element in the form of a laser diode or laser diode arrangement, whereby the semiconductor element is provided with an area of a multi-layer substrate, which at least in a partial area is designed as a micro-cooler through which cooling medium flows, and which has connectors for supplying and discharging cooling medium.

Abstract: A laser bar is soldered to a conventional microchannel copper heat sink whose coefficient of thermal expansion (CTE) is locally modified in the area where the laser bar is soldered to better match the CTE of the laser bar. A strip of ceramic material having a CTE lower than that each of the laser bar and of the copper heat sink is soldered to portions of the metallic heat sink located adjacently to the surface area on which the laser bar is located. The inclusion of the ceramic strips enables a laser bar having a nominal CTE of 6.6×10?6/K, to be soldered directly to a copper heat sink having a nominal CTE of 16.5×10?6/K without incurring thermal distortions at the interface that would limit the useful life of the laser bar.

Abstract: In an arrangement of a plurality of high-power diode lasers, each of which contains a semiconductor laser between a heatsink and a cover element, the semiconductor lasers being connected in series by their electrical contacts, it is the object of the invention to delay the need for exchanging interconnected high-power diode lasers as long as possible in the event of failure of a semiconductor laser in order to increase operating life. In order to meet this object, the electrical contacts of each semiconductor laser are connected in parallel to an electronic switching device for taking over the flow of current in the event of outage of the semiconductor laser.

Abstract: The invention refers to a novel semiconductor module with at least one semiconductor element in the form of a laser diode or laser diode arrangement, whereby the semiconductor element is provided with an area of a multi-layer substrate, which at least in a partial area is designed as a micro-cooler through which cooling medium flows, and which has connectors for supplying and discharging cooling medium.

Abstract: A laser bar is soldered to a conventional microchannel copper heat sink whose coefficient of thermal expansion (CTE) is locally modified in the area where the laser bar is soldered to better match the CTE of the laser bar. A strip of ceramic material having a CTE lower than that each of the laser bar and of the copper heat sink is soldered to portions of the metallic heat sink located adjacently to the surface area on which the laser bar is located. The inclusion of the ceramic strips enables a laser bar having a nominal CTE of 6.6×10−6/K, to be soldered directly to a copper heat sink having a nominal CTE of 16.5×10−6/K without incurring thermal distortions at the interface that would limit the useful life of the laser bar.