Abstract: A semiconductor device includes a semiconductor substrate, having an excitation circuit for applying an excitation signal, and a soft-magnetic component for guiding magnetic flux lines. The soft-magnetic component is electrically connected to the excitation by at least two electrical contacts in the form of back contacts or side contacts. The substrate further includes at least one electromagnetic transducer operatively connected to the soft-magnetic component. The excitation circuit includes a modulator for providing a modulated signal to the soft-magnetic component to modulate its magnetic permeability. The substrate further has a demodulator configured to demodulate signals obtained from the at least one electromagnetic transducer.

Abstract: A sensor device including a semiconductor substrate having an excitation circuit and a sensing circuit for measuring a magneto-impedance effect of a soft-magnetic component arranged on top of the semiconductor substrate. The soft-magnetic component is operatively connected to the excitation circuit and the sensing circuit, and is electrically connected to at least one of the excitation circuit and the sensing circuit by means of back contacts or side contacts. The soft-magnetic component has an elongated shape or an elongated portion extending in a first direction parallel to the semiconductor substrate; a processing circuit connected to the sensing circuit, and configured for providing a signal indicative of the measured impedance or a value derived therefrom. A method is provided for producing such a semiconductor substrate.

Abstract: An electronic circuit device for acquiring an analog signal. The device comprising: a data line, one or more control lines (of which at least a clock line, and configured for transmitting a stored digital measurement result using the data line and the one or more control lines, in accordance with a synchronous serial communication protocol; a detection means for recognizing a synchronization pulse on one of the one or more control lines or on the data line; wherein the device is configured for repetitively measuring the analog signal or for measuring the analog signal triggered by the synchronization pulse; and for storing one or more digital measurement results or combinations thereof when triggered by the synchronization pulse.

Abstract: The present invention relates to a current sensor device comprising: current sensing means for sensing a current, a circuit arranged to convert a signal received from the current sensing means into a signal indicative of the sensed current, storage means for storing a plurality of values of the signal indicative of the sensed current, a processing circuit arranged for receiving a subset of the plurality of values stored in the storage means, for detecting or predicting an event based on a function of the subset, said function being stored in the storage means, and for generating a corresponding event signal, said current supervisory device further comprising an interface circuit arranged to output the corresponding event signal.

Abstract: A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

Abstract: A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.