Patents by Inventor Guido Richard Struijk

Guido Richard Struijk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE AND PROCESS FOR STRAND PELLETIZING A POLYMER COMPOSITION
    Publication number: 20150021808
    Abstract: Die (1) for strand pelletizing a polymer composition, wherein the die surface (4) adjacent to the outflow opening (2) of the die is coated with a ceramic coating (5) or a polytetrafluorethylene containing coating.
    Type: Application
    Filed: February 13, 2013
    Publication date: January 22, 2015
    Applicant: DSM IP ASSETS B.V.
    Inventor: Guido Richard Struijk
  • Polyamide films for flexible printed circuit boards
    Patent number: 8778247
    Abstract: The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20° C.-Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by biaxial stretching. The film has properties suitable for carrier films in flexible printed circuit boards.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: July 15, 2014
    Assignee: DSM IP Assets B.V.
    Inventors: Alexander Antonius Marie Stroeks, Guido Richard Struijk
  • POLYAMIDE FILMS FOR FLEXIBLE PRINTED CIRCUIT BOARDS
    Publication number: 20120024577
    Abstract: The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20° C.-Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by axial stretching. The film has properties suitable for carrier films in flexible printed circuit boards.
    Type: Application
    Filed: January 15, 2010
    Publication date: February 2, 2012
    Inventors: Alexander Antonius Marie Stroeks, Guido Richard Struijk