Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.

Abstract: An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.

Abstract: The invention relates to the identification and selection of novel genomic regions (biomarker) and the identification and selection of novel genomic region combinations which are hypermethylated in subjects with prostate cancer compared to subjects without prostate cancer. Nucleic acids which selectively hybridize to the genomic regions and products thereof are also encompassed within the scope of the invention as are compositions and kits containing said nucleic acids and nucleic acids for use in diagnosing prostate cancer. Further encompassed by the invention is the use of nucleic acids which selectively hybridize to one of the genomic regions or products thereof to monitor disease regression in a patient and the efficacy of therapeutic regimens.

Abstract: An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

Abstract: An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.

Abstract: For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.

Abstract: The invention concerns a transport apparatus for transporting substrates in an oven. The oven has a channel formed from a floor and two side walls in which the substrates are transported in a transport direction. The floor of the channel has a recess running along one of the side walls for accepting and guiding a rail in transport direction. The rail is set up for accepting at least one substrate. A drive mechanism moves the rail in transport direction.

Abstract: For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.

Abstract: An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.

Abstract: The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

Abstract: In order to produce separate measured portions (1") of liquid solder, solid solder (1) in the form of wire or rod is guided through the longitudinal bore of a guide tube (20). A zone including the end (22) of the tube (20) is heated above the solder's melting temperature, in order to liquefy the solder. By contrast, an adjacent zone of the guide tube is cooled, whereby a positionally stable temperature transition is maintained in the tube (20). Thereby the amount of molten solder available above a narrowed outlet (62) is controlled. A drive mechanism (3) advances the solder (1) step by step so that the solid solder acts as a piston to eject portions of liquid solder through the aforesaid outlet (62). A suitable apparatus (5) for applying portions of solder to a substrate (4) can be raised and lowered (a). At its base it has a moulding die (6) connected to the outlet (62) that can be set down upon the substrate and has a moulding cavity open on its underside.