Abstract: An acceleration sensor for measuring accelerations in at least one direction, the sensor including: a plate-like seismic mass which responds to accelerations, is disposed within a fixed frame and is movably fastened to the frame by at least one web extending between the mass and the frame. A first light waveguide for receiving a light beam from a light source, is disposed on a surface of the seismic mass so that a light beam passing therethrough is deflected as a function of movement of the seismic mass, and a second light waveguide is disposed on a surface of the fixed frame opposite an end of the first light waveguide for coupling the light beam to a detector for detecting deflections of the light beam as a measure of detected acceleration by the sensor. Preferably, the first and second light waveguides comprise planar light conductor paths or strips and the mass, webs and frame are all formed of silicon.

Abstract: Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has larger dimensions than the component chip and which is disposed between the underside of the component chip and the mounting base for the component chip. The channels are filled with a meltable material which is subjected to a heat absorbing phase conversion at temperatures which are critical for semiconductor component operation. In this way, short-term heat peaks in particular, can be reliably dissipated. Preferably, the channels are formed by micromechanical etching techniques and are preferably filled to the desired degree by a spin coating process.