Abstract: Described herein is a hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate; a heating structure disposed above the thermal-insulating layer, and thermally and electrically isolated from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure; and a sensitive layer disposed on the thermal-conducting layer. The sensitive layer can be heated to a set temperature by the heating structure to improve sensitivity and reduce the response time.

Abstract: Described herein is a hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate; a heating structure disposed above the thermal-insulating layer, and thermally and electrically isolated from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure; and a sensitive layer disposed on the thermal-conducting layer. The sensitive layer can be heated to a set temperature by the heating structure to improve sensitivity and reduce the response time.

Abstract: An in-situ compressed specimen of copper interconnection micro column, which is a circular metal column formed in a PDMS hole, includes: a specimen part and a fixed end part for fixing the specimen; wherein the fixed end part is a circular or square plate structure, the specimen part is an upper part of the fixed end part; a main body of the present invention is of micron order, a forced direction of the specimen is consistent with a growth direction of the metal column. A method of electroplating copper column by adopting PDMS as template substrate is applied to overcome a problem that TSV is corrosive to the copper column during a silicon etching process so as to affect a mechanical property accuracy test, the method is advanced in shortening test process period, achieving good reproducibility and high yield.