Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract: A test socket is provided including a socket board, socket pins and a guiding member. The socket pins are exposed to an upper surface of the socket board and are configured to be electrically contacted by external terminals of an object. The guiding member is disposed on an upper surface of the socket board and is arranged to guide the external terminals as a single unit to contact the external terminals with the socket pins. The guiding member is also configured to a center of the socket board with a center of the object.

Abstract: A handler tray may include a tray body and a socket. The tray body may be configured to receive an object. The tray body with the object may be transferred to a test board. The tray body may be selectively interposed between the object and the test board to supply a test current from the test board to external terminals of the object. The socket may be formed on the tray body. The socket may electrically make contact with the external terminals of the object. Thus, a pick-up robot and an insert may be unnecessary, so that a test system and method of testing the object may have an optimally available space.

Abstract: A test socket is provided including a socket board, socket pins and a guiding member. The socket pins are exposed to an upper surface of the socket board and are configured to be electrically contacted by external terminals of an object. The guiding member is disposed on an upper surface of the socket board and is arranged to guide the external terminals as a single unit to contact the external terminals with the socket pins. The guiding member is also configured to a center of the socket board with a center of the object.