Abstract: The instrument includes a dual-wall deformable tube, with an inner sleeve, a coaxial outer sleeve, and an imaging module connected to the inner and outer sleeves. An array of transducers is carried by an outer face of the imaging module. The inner sleeve and the outer sleeve are mobile in relative axial translation between: a folded position in which the inner and outer sleeves both have a cylindrical shape, and in which the imaging module substantially extends in the continuation of the inner sleeve; and an expanded position, in which the inner sleeve has a cylindrical shape and the outer sleeve has a flared shape widening on the distal side and in which the imaging module substantially extends with the face that carries the transducers of the array turned in axial direction towards the front of the deformable tube.

Abstract: A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

Abstract: A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

Abstract: A piezoelectric bimorph cantilever beam system includes a shim having a first main surface, a second main surface opposite the first main surface, a proximal end connected to an anchor, and a distal end opposite the proximal end. The system further includes a first piezoelectric layer laminated on the first main surface of the shim and a second piezoelectric layer laminated on the second main surface of the shim. A first beam stiffener is provided over the first main surface of the shim adjacent to the anchor with the first beam stiffener at least partially covering the first piezoelectric layer. A second beam stiffener is provided over the second main surface of the shim adjacent to the anchor with the second beam stiffener at least partially covering the second piezoelectric layer.

Abstract: A flexible printed circuit board includes a central portion and one or more tabs extending from the central portion. The one or more tabs are foldable relative to the central portion. A plurality of pads are located within the central portion, and the plurality of pads are configured to electrically connect to a transducer. Lands are located within one of the one or more tabs, and electrical traces connect the plurality of pads and the lands. A method of manufacturing an electronics assembly includes providing a flexible printed circuit board with a plurality of central portions and folding the substrate such that the adjacent central portions are vertically stacked and the pads of adjacent central portions are electrically connected. Prior to folding the substrate, a transducer may be affixed to the plurality of pads and one or more electrical components may be affixed to the lands.

Abstract: An energy harvester converts into electrical energy the external stresses applied to the implant at the rhythm of the heartbeats. This harvester comprises an inertial unit. A transducer provides an oscillating electrical signal that is rectified and regulated, for powering the implant and/or charging a battery. The instantaneous variations of this electrical signal between two heartbeats are analyzed inside successive time windows, to derive therefrom a physiological parameter and/or a physical activity parameter of the patient with the implant, in particular as a function of a peak of amplitude of the first oscillation of the electrical signal, and of the level of this signal after the bounce phase of the signal oscillation.

Abstract: The instrument includes a dual-wall deformable tube, with an inner sleeve, a coaxial outer sleeve, and an imaging module connected to the inner and outer sleeves. An array of transducers is carried by an outer face of the imaging module. The inner sleeve and the outer sleeve are mobile in relative axial translation between: a folded position in which the inner and outer sleeves both have a cylindrical shape, and in which the imaging module substantially extends in the continuation of the inner sleeve; and an expanded position, in which the inner sleeve has a cylindrical shape and the outer sleeve has a flared shape widening on the distal side and in which the imaging module substantially extends with the face that carries the transducers of the array turned in axial direction towards the front of the deformable tube.

Abstract: An energy harvester converts into electrical energy the external stresses applied to the implant at the rhythm of the heartbeats. This harvester comprises an inertial unit. A transducer provides an oscillating electrical signal that is rectified and regulated, for powering the implant and/or charging a battery. The instantaneous variations of this electrical signal between two heartbeats are analyzed inside successive time windows, to derive therefrom a physiological parameter and/or a physical activity parameter of the patient with the implant, in particular as a function of a peak of amplitude of the first oscillation of the electrical signal, and of the level of this signal after the bounce phase of the signal oscillation.

Abstract: A piezoelectric bimorph cantilever beam system includes a shim having a first main surface, a second main surface opposite the first main surface, a proximal end connected to an anchor, and a distal end opposite the proximal end. The system further includes a first piezoelectric layer laminated on the first main surface of the shim and a second piezoelectric layer laminated on the second main surface of the shim. A first beam stiffener is provided over the first main surface of the shim adjacent to the anchor with the first beam stiffener at least partially covering the first piezoelectric layer. A second beam stiffener is provided over the second main surface of the shim adjacent to the anchor with the second beam stiffener at least partially covering the second piezoelectric layer.

Abstract: An ultrasound transducer includes a first piezoelectric layer stacked on a second piezoelectric layer to form a stack. The first piezoelectric layer has one major face metallized to form a first array of electrodes and the other major face metallized to form a first ground electrode. The second piezoelectric layer has one major face metallized to form a second array of electrodes and the other major face metallized to form a second ground electrode, the second array of electrodes oriented at an angle to the first array of electrodes. The second piezoelectric layer has a thickness such that an overall thickness of the stack is equal to an uneven number of half-wavelengths of an acoustic wave to be generated when the first piezoelectric layer and the second piezoelectric layer are independently operated. The ultrasound transducer also includes an acoustic impedance adaptation layer, an acoustic damping layer, and a stiffener.

Abstract: A vibrational multi-morph piezoelectric energy harvester includes a composite shim having a parallelepiped form with a thickness dimension made smaller than width and length dimensions, and having a stiffness shifting from one extremity to the other extremity to minimize mechanical constraints developed at a clamping area; a seismic mass mounted at an end opposite to the clamping area to mechanically match the system to the surrounding vibration resonance; one or more piezoelectric layers laminated on said composite shim; and electrodes plated onto the one or more piezoelectric layers for connection to an electronic harvesting circuit, a battery, or a super capacitor.

Abstract: A vibrational multi-morph piezoelectric energy harvester includes a composite shim having a parallelepiped form with a thickness dimension made smaller than width and length dimensions, and having a stiffness shifting from one extremity to the other extremity to minimize mechanical constraints developed at a clamping area; a seismic mass mounted at an end opposite to the clamping area to mechanically match the system to the surrounding vibration resonance; one or more piezoelectric layers laminated on said composite shim; and electrodes plated onto the one or more piezoelectric layers for connection to an electronic harvesting circuit, a battery, or a super capacitor.