Patents by Inventor Guillaume GERIN

Guillaume GERIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11822990
    Abstract: A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 21, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Guillaume Gerin, Stephan Danler-Baumgartner, Damien Richard
  • Patent number: 11681891
    Abstract: An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: June 20, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Kevin Fabrizio, Guillaume Gerin
  • Patent number: 11630978
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 18, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Lea Vaccarello, Guillaume Gerin, Stephan Danler-Baumgartner
  • Publication number: 20220207317
    Abstract: An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 30, 2022
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Kevin FABRIZIO, Guillaume GERIN
  • Publication number: 20220172015
    Abstract: A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 2, 2022
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Guillaume GERIN, Stephan DANLER-BAUMGARTNER, Damien RICHARD
  • Publication number: 20220083830
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Application
    Filed: December 6, 2019
    Publication date: March 17, 2022
    Applicant: Smart Packaging Solutions
    Inventors: Lea VACCARELLO, Guillaume GERIN, Stephan DANLER-BAUMGARTNER
  • Patent number: 11250306
    Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: February 15, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Bernard Calvas, Guillaume Gerin, Kevin Fabrizio
  • Publication number: 20200394484
    Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
    Type: Application
    Filed: November 20, 2018
    Publication date: December 17, 2020
    Applicant: Smart Packaging Solutions
    Inventors: Bernard CALVAS, Guillaume GERIN, Kevin FABRIZIO