Abstract: A method for manufacturing a thermoelectric structure including the following steps: a) providing a substrate made from a first material, b) depositing a thermoelectric element made from a second material on the substrate, by additive manufacturing, preferably by SLS or PBF, c) thinning and cutting the substrate until a film made from the first material is obtained, by means of which a thermoelectric structure comprising a film and the thermoelectric element is obtained.

Abstract: A method for manufacturing a thermoelectric structure including the following steps: a) providing a substrate, covered with a metal layer, b) forming a thermoelectric element on the metal layer, by additive manufacturing, preferably by SLS or PBF, and c) optionally removing the substrate, by means of which a thermoelectric structure, which comprises the metal layer and the thermoelectric element, is obtained.

Abstract: An electronic component may include a carrier, and a thermoelectric sensor and a power transistor which are arranged on the carrier. The power transistor may include a base layer containing a transistor material chosen from among gallium nitride, aluminium gallium nitride, gallium arsenide, indium gallium, indium gallium nitride, aluminium nitride, indium aluminium nitride, and mixtures thereof. The electronic component may be configured so that the thermoelectric sensor generates an electric current under the effect of heating from the power transistor.

Abstract: A multilayer thermoelectric sensor for generating an electric current under the effect of heating includes a support and a thermocouple borne by the support. The thermocouple includes a first thermoelectric member having at least a portion of a bilayer, the layers of which are made of different materials, and a second thermoelectric member having a p-doped semiconductor material and/or a thermoelectric metal. The thermocouple is configured to generate an electron gas at the interface between the layers of the bilayer when the thermoelectric sensor is heated.

Abstract: A method for manufacturing a thermoelectric device where a first part formed in a first doped material and a second part formed in a second doped material each shaped like a comb are manufactured, before being assembled together and electrically connected. Then, the first base of the first part is sectioned into at least one first area and the second base of the second part is sectioned into at least one second area. Each first branch of the first part and each second branch of the second part separated respectively constitute a first element and a second element of a thermoelectric junction, electrically connected via portion of the second base that links them. In addition, each first branch and each second branch separated by a second area constitute a first element and a second element of a thermoelectric junction, electrically connected via the portion of the first base.

Abstract: A method for manufacturing a thermoelectric device where a first part formed in a first doped material and a second part formed in a second doped material each shaped like a comb are manufactured, before being assembled together and electrically connected. Then, the first base of the first part is sectioned into at least one first area and the second base of the second part is sectioned into at least one second area. Each first branch of the first part and each second branch of the second part separated respectively constitute a first element and a second element of a thermoelectric junction, electrically connected via portion of the second base that links them. In addition, each first branch and each second branch separated by a second area constitute a first element and a second element of a thermoelectric junction, electrically connected via the portion of the first base.

Abstract: A device including a deformable shell delimiting an inner space, and a resilient band suspended in the inner space and including two ends secured to the deformable shell. The band includes a piezoelectric material to generate an electric voltage under the effect of the deformation of the shell and two electrodes for collecting the voltage. An electronic circuit for processing the voltage is arranged on the resilient band and connected to the electrodes of the resilient band.

Abstract: A device is provided, including a deformable shell defining an inner space including at least one piezoelectric system. The piezoelectric system includes a flexible piezoelectric membrane capable of generating electric energy under the effect of a deformation to which it is submitted, a rechargeable electric power source, formed on a flexible substrate, and an electronic circuit. The electronic circuit includes a processing circuit for generating and storing data according to the electric energy generated by the piezoelectric membrane, and connected to the electric power source for its electric power supply, and a wireless transmitter connected to the processing circuit to transmit the data stored therein and connected to the electric power source for its electric power supply. Each piezoelectric system is totally arranged on and/or inside of the deformable shell.

Abstract: Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member (2) of the substrate (3) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member (2) respectively to each first and each second connection pad, the support member (2) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).

Abstract: A system includes a hot source, a cold source, and a device thermally coupled between the hot source and the cold source. The device includes a thermal-mechanical transducer and a mechanical-electrical transducer. The thermal-mechanical transducer includes a band of bimetallic strips linked mechanically together by their longitudinal ends. The band partially suspended over a portion of a substrate. Each bimetallic strip has a first stable state having a first curvature and a second stable state having a second curvature opposite the first curvature, and adjacent bimetallic strips have opposite curvature.

Abstract: A device (10) including a deformable shell (12) delimiting an inner space (14), and: a resilient band (18, 30, 32) suspended in the inner space (14) and including two ends secured to the deformable shell (12), said band (18, 30, 32) including a piezoelectric material (30, 32) to generate an electric voltage under the effect of the deformation of the shell (12) and two electrodes for collecting the voltage; and an electronic circuit (34) for processing the voltage, arranged on the resilient band (18, 30, 32) and connected to the electrodes of the resilient band (18, 30, 32).

Abstract: System for converting thermal energy into electrical energy (S1) intended to be arranged between a hot source (SC) and a cold source (SF), comprising means for converting thermal energy into mechanical energy (6) and a piezoelectric material, with the means for converting thermal energy into mechanical energy (6) comprising groups (G1, G2) of at least three bimetallic strips (9, 11, 13) linked mechanically together by their longitudinal ends and suspended above a substrate (12), each bimetallic strip (9, 11, 13) comprising two stable states wherein it has in each of the states a curvature, with two directly adjacent bimetallic strips (9, 11, 13) having for a given temperature opposite curvatures, with the switching from one stable state of the bimetallic strips (9, 11, 13) to the other causing the deformation of a piezoelectric material.

Abstract: An assembly converting thermal energy into electrical energy including: at least one temperature sensitive bimetallic strip arranged in a space delimited by a hot source and a cold source facing each other, the bimetallic strip extending along a longitudinal axis; at least one suspended element fixed in movement to the sensitive element and extending laterally from the sensitive element and including a free end; and at least one piezoelectric element suspended from a part fixed relative to the sensitive element and vibrated by the suspended element such that it is vibrated when the bimetallic strip changes configuration and the suspended element comes into contact with the piezoelectric element, the piezoelectric element being located outside the space defined between the bimetallic strip and the hot source and outside the space between the bimetallic strip and the cold source.

Abstract: This sensor (1) includes an assembly of thermoelectric layers, a support member (2) including at least one first and one second metallic connector pins (30, 31), first and second metal connectors arranged to electrically connect the support member (2) respectively to a first connection pad and a second connection pad, an external package (8) including a first surface (8a) and a second opposite surface (8b) intended to be respectively connected to a hot source and to a cold source, a first via (80) connecting the first surface (8a) to each first connector pin (30), a second via (81) connecting the second surface (8b) to each second connector pin (31), and the support member (2) includes thermal conductors between the connector pins (30, 31) and the metal connectors.

Abstract: A device includes a deformable shell that defines an inner space under a gas pressure higher than the atmospheric pressure. A flexible piezoelectric membrane is applied against an inner wall of the deformable shell under the effect of the pressure present in the inner space. The membrane is capable of generating electric energy under the effect of a deformation of the shell. An electric circuit is electrically connected to the piezoelectric membrane and includes an element for storing the electric energy that it generates and a rigid structure. Longilineal resilient elements for holding the electric circuit according to a predetermined position of the inner space are each arranged between the rigid structure of the electric circuit and the inner wall of the deformable shell and secured to the piezoelectric membrane and to the rigid structure.

Abstract: A device includes a rigid outer shell defining a hollow inner space. The device also includes an inner shell defining a hollow inner space. The inner shell is housed in the inner space of the outer shell and capable of freely displacing therein and including at least one layer of piezoelectric material capable of generating electric energy under the effect of an impact to which it is submitted against the outer shell. An electric circuit is housed in the inner space of the inner shell, electrically connected to the piezoelectric material layer, and includes an element for storing the electric energy generated by the piezoelectric material layer of the inner shell. Further, the device includes elements for holding the electric circuit in the inner shell.

Abstract: The device includes a thermoelectric module provided with a thermocouple. Said thermocouple includes a first and second leg which are made of different thermoelectric materials, electrically connected by a connecting element configured to deform according to the temperature thereof so as to assume: a first deformation position in which the first and second legs are electrically connected in series solely by means of the connecting element; and a second deformation position in which the connecting element is in electrical contact with a shunt contact pad of the device, said shunt contact pad being made of a material, the electrical conductivity of which is greater than the electric conductivity of the connecting element and of the first and second legs. The device also includes a load, the electrical resistance of which is lower than the electrical resistance of the thermoelectric module, said load being electrically connected to the shunt contact pad.

Abstract: This sensor (1) includes an assembly of thermoelectric layers, a support member (2) including at least one first and one second metallic connector pins (30, 31), first and second metal connectors arranged to electrically connect the support member (2) respectively to a first connection pad and a second connection pad, an external package (8) including a first surface (8a) and a second opposite surface (8b) intended to be respectively connected to a hot source and to a cold source, a first via (80) connecting the first surface (8a) to each first connector pin (30), a second via (81) connecting the second surface (8b) to each second connector pin (31), and the support member (2) includes thermal conductors between the connector pins (30, 31) and the metal connectors.

Abstract: Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member (2) of the substrate (3) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member (2) respectively to each first and each second connection pad, the support member (2) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).

Abstract: A racket having a handle, a frame attached to the handle, and strings with two perpendicular strings stretched in the frame, running back and forth in the frame. The system also includes: for each string, a piezoelectric sheath coating said string along most of its length, said sheath being divided along its length into at least three piezoelectric areas capable of each generating an independent voltage according to mechanical stress exerted on the strings; and an electronic circuit connected to the piezoelectric areas of the strings to identify a portion of the strings submitted to the highest mechanical stress according to the voltages generated by the piezoelectric areas of the strings.