Abstract: A mold cooling arrangement includes a plurality of closed bores vertically disposed in the mold between the molding surface and the mold exterior. A manifold positioned vertically above the mold communicates with the interior of each bore and a condenser is disposed vertically above and communicates with the manifold. The bores and manifold are at least partially filled with a phase change liquid such as distilled water which during operation of the mold is partially vaporized. The vapor rises to the condenser where it is converted back to liquid and returns by gravity to the manifold and mold bores. The rate of heat transfer from the mold to the liquid is controlled by developing an electrical signal proportional to mold temperature and using the difference between that signal and a set reference temperature signal to control the rate of flow of a secondary coolant into the condenser of the system in order to vary the pressure in the system, in turn, to control the rate of mold cooling.

Abstract: A mold cooling arrangement includes a plurality of closed bores vertically disposed in the mold between the molding surface and the mold exterior. A manifold positioned vertically above the mold communicates with the interior of each bore and a condenser is disposed vertically above and communicates with the manifold. The bores and manifold are at least partially filled with a liquid such as distilled water which partially evaporized during operation of the mold and the vapor rinse to the condenser is converted back to liquid and return by gravity to the manifold and mold bores.