Abstract: A multi-axis MEMS assembly is configured to provide multi-axis movement and includes: a first in-plane MEMS actuator configured to enable movement along at least an X-axis; and a second in-plane MEMS actuator configured to enable movement along at least a Y-axis; wherein the first in-plane MEMS actuator is coupled to the second in-plane MEMS actuator.

Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

Abstract: A MEMS imaging actuator assembly includes: a first structural assembly; a second structural assembly; and a tip-tilt displacement assembly, configured to position the first structural assembly with respect to the second structural assembly, including: one or more multi-morphic thin film actuator assemblies, and one or more motion control assemblies; wherein one of the structural assemblies is configured to mount an optical device.

Abstract: A method for full Os isotope static measurement by NTIMS includes steps of: selecting and weighing rock samples, and dissolving the rock samples to obtain dissolution liquid; chemically separating Os from the dissolution liquid to obtain purified Os solution; loading the purified Os solution on a Pt filament to obtain a sample to be determined; selecting Faraday cups and ion counters, as well as 1012? and 1013? amplifiers in NTIMS based on natural abundances of different Os isotopes, thereby establishing a cup configuration for the full Os isotope static measurement; establishing a yield calibration method for ICs; performing full Os isotopes static measurement based on the yield-calibrated ion counters and gain-calibrated faraday cups; and processing analytical data to obtain a final data of Os isotopic composition. The method enables the determination of the full Os isotope and oxygen isotope compositions of low-content or small-size samples.

Abstract: A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator; wherein the in-plane MEMS actuator includes an electromagnetic actuator portion.

Abstract: An electrically-conductive, MEMS flexure assembly includes: a first MEMS subportion including a first plurality of electrically-conductive pads; a second MEMS subportion including a second plurality of electrically-conductive pads; and a plurality of MEMS electrically-conductive flexures electrically coupling the first plurality of electrically-conductive pads on the first MEMS subportion and the second plurality of electrically-conductive pads on the second MEMS subportion.

Abstract: A MEMS image sensor assembly includes: a common magnet assembly; an image sensor subassembly; an in-plane actuation subassembly that utilizes the common magnet assembly to effectuate in-plane movement of the lens assembly and/or the image sensor subassembly; and an out-of-plane actuation subassembly that utilizes the common magnet assembly to effectuate out-of-plane movement of the lens assembly and/or the image sensor subassembly.

Abstract: A method of generating a piezoelectric actuator includes: forming a piezoelectric member upon a rigid substrate; and removing one or more portions of the rigid substrate to form one or more gaps in the rigid substrate, thus defining at least one deformable portion of the piezoelectric member and at least one rigid portion of the piezoelectric member.

Abstract: A MEMS lens/image sensor assembly including: an image sensor subassembly; an image stabilization subassembly affixed to and electrically coupled to the image sensor subassembly; and a lens barrel assembly affixed to the image stabilization assembly.

Abstract: A glass membrane deformation assembly configured to deform a glass membrane includes: a deformable glass membrane having a first surface and a second surface; a piezoelectric layer affixed to a first surface of the deformable glass membrane, wherein the piezoelectric layer is controllably deformable via a voltage potential; a structural member affixed to at least a first portion of the second surface of the deformable glass membrane; and a deformable lens assembly affixed to at least a second portion of the second surface of the deformable glass membrane; wherein the controllably deformation of the piezoelectric layer is configured to controllably deform the deformable glass membrane and the deformable lens assembly.

Abstract: A spacer assembly includes: an essentially-planer structural portion configured to position an image sensor on a MEMS actuator; an outer sub-portion configured to be mounted to the MEMS actuator; and an inner sub-portion configured to mount the image sensor.

Abstract: A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator.

Abstract: A temporary MEMS-based locking assembly is configured to temporarily compress electrically conductive flexures and includes: a first locking structure coupled to a first portion of a MEMS conductive assembly; a second locking structure coupled to a second portion of the MEMS conductive assembly, wherein: the electrically conductive flexures are positioned between the first portion of the MEMS conductive assembly and the second portion of the MEMS conductive assembly, and the first and second locking structures are configured to engage each other upon the compression of the electrically conductive flexures to effectuate the locking of the first portion of the MEMS conductive assembly with respect to the second portion of the MEMS conductive assembly.

Abstract: A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator including a multi-morph piezoelectric actuator; an optoelectronic device coupled to the in-plane MEMS actuator; and a lens barrel assembly coupled to the out-of-plane MEMS actuator.

Abstract: A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

Abstract: A multi-axis MEMS assembly includes a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement. The micro-electrical-mechanical system (MEMS) actuator includes: an in-plane MEMS actuator, and an out-of-plane MEMS actuator. An optoelectronic device is coupled to the micro-electrical-mechanical system (MEMS) actuator. The out-of-plane MEMS actuator includes a multi-morph piezoelectric actuator.

Abstract: A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.

Abstract: A micro-electrical-mechanical system (MEMS) actuator includes a first set of actuation fingers, a second set of actuation fingers, and a first spanning structure configured to couple at least two fingers of the first set of actuation fingers while spanning at least one finger of the second set of actuation fingers.

Abstract: A micro-electrical-mechanical system (MEMS) assembly includes a micro-electrical-mechanical system (MEMS) actuator configured to be coupled, on a lower surface, to a printed circuit board, an image sensor assembly coupled to an upper surface of the micro-electrical-mechanical system (MEMS) actuator, and a holder assembly coupled to and positioned with respect to the micro-electrical-mechanical system (MEMS) actuator.

Abstract: A method of producing a MEMS assembly includes: producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor; and coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly.