Patents by Inventor Guiu TIO MEDINA

Guiu TIO MEDINA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240202383
    Abstract: Information on assembly components to be printed by a three dimensional (3D) printer is accessed. Different assembly arrangements are determined based on the information to optimise three dimensional (3D) nesting.
    Type: Application
    Filed: April 26, 2021
    Publication date: June 20, 2024
    Inventors: Guiu Tio Medina, Sergio Gonzalez Martin, Jordi Roca Vila
  • Publication number: 20230173761
    Abstract: In an example a method comprises receiving at a processor, a digital model representing an object to be produced by additive manufacturing. The method may comprise receiving, at the processor, a selected location on a surface of the object, where a label is to be formed. The method may further comprise defining a label displacement map associated with the selected location, applying the label displacement map to the digital model, and rendering the digital model including the label displacement map into voxels for additive manufacturing.
    Type: Application
    Filed: May 8, 2020
    Publication date: June 8, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sergio Gonzalez Martin, Jordi Roca Vila, Guiu Tio Medina
  • Publication number: 20220335180
    Abstract: According to examples, a processor may dilate a first digital model of a first 3D part a predefined amount and a second digital model of a second 3D part the predefined amount, in which the first 3D part and the second 3D part are to be fabricated together in an assembly to have a functional relationship with respect to each other, and in which the first digital model and the second digital model are spaced from each other in a manner that corresponds to a spacing of the first 3D part and the second 3D part in the assembly. The processor may determine a spatial relationship between the dilated first digital model and the dilated second digital model and may determine, based on the determined spatial relationship, whether the assembly of the first 3D part and the second 3D part is predicted to function properly when the assembly is fabricated.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 20, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jordi ROCA VILA, Guiu TIO MEDINA, Sergio GONZALEZ MARTIN