Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position corresponding to the upper surface slit, and the upper surface slit is connected with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

Abstract: The present disclosure provides a metal shell of communication equipment. The metal shell of communication equipment includes a metal substrate, a slit penetrating an inner and an outer surface of the metal substrate, a plastic-supporting layer formed on the inner surface of the metal substrate and a decorative layer formed on the outer surface of the metal substrate, wherein a width of the slit on the outer surface of the metal substrate is 15-500 ?m, a width of the slit on the inner surface of the metal substrate is 20-600 ?m, and a ratio of the width of the slit on the inner surface of the metal substrate to the width of the slit on the outer surface of the metal substrate is between 1.05:1 and 1.5:1.

Abstract: The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.

Abstract: The present disclosure provides a metal shell of communication equipment. The metal shell of communication equipment includes a metal substrate, a slit penetrating an inner and an outer surface of the metal substrate, a plastic-supporting layer formed on the inner surface of the metal substrate and a decorative layer formed on the outer surface of the metal substrate, wherein a width of the slit on the outer surface of the metal substrate is 15-500 ?m, a width of the slit on the inner surface of the metal substrate is 20-600 ?m, and a ratio of the width of the slit on the inner surface of the metal substrate to the width of the slit on the outer surface of the metal substrate is between 1.05:1 and 1.5:1.