Patents by Inventor Guizhen Yan

Guizhen Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Head module, large-scale container and method for manufacturing the both
    Patent number: 10748666
    Abstract: A head module for a large-scale container, a large-scale container having the head module, and methods for manufacturing the head module and the large-scale container. The method for manufacturing a head module comprises providing a head having an annular opening, the head being composed of a plurality of petals, providing a plurality of cylinder plates, and forming a head cylindrical ring, connecting in order the plurality of cylinder plates to the end surface of the annular opening and joining facing sides of all adjacent cylinder plates. Based on the unfitness of the petals at the annular opening of the head, gaps between adjacent cylinder plates may be adjusted, and/or the positions of the cylinder plates on the end surface of the annular opening of the head may be adjusted radially inwards or outwards.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: August 18, 2020
    Assignees: State Nuclear Power Technology Corporation Ltd., Shandong Nuclear Power Equipment Manufacturing Co., Ltd., Shanghai Nuclear Engineering Research and Design Institute, Shandong Electric Power Engineering Consulting Institute Corporation Limited
    Inventors: Jun Li, Guobiao Wang, Zhongwei Yang, Guizhen Yan, Honghui Ge, Shenhui Zhai, Jin Han, Shenghua Liu, Ting Xu, Laiyun Chen, Xiaoping Peng
  • Mounting structure for equipment compartment bottom plate
    Patent number: 10071751
    Abstract: A mounting structure for equipment compartment bottom plate is provided. The bottom plate is detachably connected to a skeleton boundary beam of the equipment compartment. A sliding rail is fixedly connected to a side of the bottom plate where the bottom plate is lap-jointed to a skeleton lateral beam of the equipment compartment. One of the sliding rail and the skeleton lateral beam is provided with a recess and the other is provided with a protrusion engaged with the recess. In the mounting structure, the connection of the bottom plate and the skeleton lateral beam is achieved by the engagement of the recess and the protrusion. Therefore, connecting pieces for connecting the bottom plate and the skeleton lateral beam are removed and the number of the connecting pieces is significantly reduced.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: September 11, 2018
    Assignee: CRRC QINGDAO SIFANG CO., LTD.
    Inventors: Wenmin Yu, Zhaohua Wang, Shuhai Li, Yonglin Shan, Zhicheng Guo, Aiqin Tian, Guizhen Yan, Lijun Ma, Sansan Ding, Jianying Liang
  • MOUNTING STRUCTURE FOR EQUIPMENT COMPARTMENT BOTTOM PLATE
    Publication number: 20170190338
    Abstract: A mounting structure for equipment compartment bottom plate is provided. The bottom plate is detachably connected to a skeleton boundary beam of the equipment compartment. A sliding rail is fixedly connected to a side of the bottom plate where the bottom plate is lap-jointed to a skeleton lateral beam of the equipment compartment. One of the sliding rail and the skeleton lateral beam is provided with a recess and the other is provided with a protrusion engaged with the recess. In the mounting structure, the connection of the bottom plate and the skeleton lateral beam is achieved by the engagement of the recess and the protrusion. Therefore, connecting pieces for connecting the bottom plate and the skeleton lateral beam are removed and the number of the connecting pieces is significantly reduced.
    Type: Application
    Filed: November 16, 2015
    Publication date: July 6, 2017
    Applicant: CRRC QINGDAO SIFANG CO., LTD.
    Inventors: Wenmin YU, Zhaohua WANG, Shuhai LI, Yonglin SHAN, Zhicheng GUO, Aiqin TIAN, Guizhen YAN, Lijun MA, Sansan DING, Jianying LIANG
  • Head Module, Large-scale Container and Method for Manufacturing the Both
    Publication number: 20140254739
    Abstract: A head module for a large-scale container, a large-scale container having the head module, and methods for manufacturing the head module and the large-scale container. The method for manufacturing a head module comprises providing a head having an annular opening, the head being composed of a plurality of petals, providing a plurality of cylinder plates, and forming a head cylindrical ring, connecting in order the plurality of cylinder plates to the end surface of the annular opening and joining facing sides of all adjacent cylinder plates. Based on the unfitness of the petals at the annular opening of the head, gaps between adjacent cylinder plates may be adjusted, and/or the positions of the cylinder plates on the end surface of the annular opening of the head may be adjusted radially inwards or outwards.
    Type: Application
    Filed: April 9, 2014
    Publication date: September 11, 2014
    Applicants: State Nuclear Power Technology Corporation Ltd., Shandong Nuclear Power Equipment Manufacturing Co. Ltd.
    Inventors: Jun Li, Guobiao Wang, Zhongwei Yang, Guizhen Yan, Jin Han
  • Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process
    Patent number: 7618837
    Abstract: The invention discloses a novel flexible, modular fabrication method for integrated high aspect ratio single crystal silicon microstructures designed and manufactured in a post conventional CMOS process (Post-CMOS). The method involves the standard circuits formation, the electrical isolation trenched etching and refilling, backside etching, interconnection formation, and structure releasing. Further, a method of tailoring the trench profile for refill the trench fully without void is also disclosed.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: November 17, 2009
    Assignee: Peking University
    Inventors: Guizhen Yan, Yong Zhu, Jie Fan, Xuesong Liu, Jian Zhou, Yangyuan Wang
  • Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process
    Publication number: 20050287760
    Abstract: The invention discloses a novel flexible, modular fabrication method for integrated high aspect ratio single crystal silicon microstructures designed and manufactured in a post conventional CMOS process (Post-CMOS). The method involves the standard circuits formation, the electrical isolation trenched etching and refilling, backside etching, interconnection formation, and structure releasing. Further, a method of tailoring the trench profile for refill the trench fully without void is also disclosed.
    Type: Application
    Filed: April 22, 2005
    Publication date: December 29, 2005
    Inventors: Guizhen Yan, Yong Zhu, Jie Fan, Xuesong Liu, Jian Zhou, Yangyuan Wang