Patents by Inventor Gun Ah Lee

Gun Ah Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for stacking semiconductor chips in a semiconductor package
    Patent number: 10483150
    Abstract: An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: November 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gun-Ah Lee, Ji-Hwan Hwang, Cha-Jea Jo, Dong-Han Kim, Seung-Kon Mok
  • APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE
    Publication number: 20170236798
    Abstract: An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.
    Type: Application
    Filed: November 11, 2016
    Publication date: August 17, 2017
    Inventors: GUN-AH LEE, Jl-HWAN HWANG, CHA-JEA JO, DONG-HAN KIM, SEUNG-KON MOK
  • Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
    Patent number: 7148080
    Abstract: A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation property and an inter-metallic diffusion property, and may be formed of gold wires, gold bumps, gold bars, solder bumps, solder, or solder bars. By clamping or compressing the lead frames under heat and pressure, the joining mediator forms an inter-metallic joint layer that reliably interconnects the lead frames at the joining portions.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: December 12, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Pyoung Wan Kim, Sang Hyeop Lee, Chang Cheol Lee, Gun Ah Lee
  • Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
    Publication number: 20040014257
    Abstract: A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation property and an inter-metallic diffusion property, and may be formed of gold wires, gold bumps, gold bars, solder bumps, solder, or solder bars. By clamping or compressing the lead frames under heat and pressure, the joining mediator forms an inter-metallic joint layer that reliably interconnects the lead frames at the joining portions.
    Type: Application
    Filed: March 7, 2003
    Publication date: January 22, 2004
    Inventors: Pyoung Wan Kim, Sang Hyeop Lee, Chang Cheol Lee, Gun Ah Lee