Abstract: An electronic device is provided. The electronic device includes a first housing, a second housing including a first surface, a second surface, and a third surface, an antenna module including a printed circuit board (PCB) and conductive patches disposed on one surface of the PCB facing the third surface of the second housing, a conductive plate disposed between the antenna module and the third surface of the second housing, and a wireless communication circuit electrically connected to the antenna module, wherein the conductive patches may be positioned at a first height from the second surface of the second housing, wherein the conductive plate may be parallel to the second surface of the second housing and positioned at a second height lower than the first height of the conductive patches, and wherein the wireless communication circuit may be configured to supply power to the conductive patches to transmit and/or receive a signal in a frequency band of 20 gigahertz (GHz) or more.

Abstract: Electronic devices including an antenna module and the antenna module are presented. The electronic devices may include a housing, a wireless communication module, a plurality of slits provided in the housing, and an antenna module disposed inside the housing to correspond to the plurality of slits and operatively connected to the wireless communication module. The antenna module may include a printed circuit board, a plurality of conductive patches disposed on a first surface of the printed circuit board, and an RFIC disposed on a second surface of the printed circuit board. The plurality of conductive patches are configured to be disposed in the plurality of slits. As a result, it is possible to secure a space for disposing different electronic components included in the electronic device.

Abstract: An electronic device according to various embodiments disclosed in this document may include: a display panel; a recognition member disposed under the display panel and including a conductive pattern to recognize a signal from a pen input device; a first shielding member disposed under the recognition member; and a second shielding member disposed under the first shielding member and made of a material different than the first shielding member, wherein the second shielding member includes a component region corresponding to at least one electronic component disposed under the second shielding member, and wherein at least a portion of the second shielding member is removed from the component region.

Abstract: A probe of a scanning probe microscope (SPM) having a field-effect transistor (FET) structure at the tip of the probe, and a method of fabricating the probe are provided. The SPM prove having a source, channel and drain is formed by etching a single crystalline silicon substrate into a V-shaped groove and doping the etching sloping sides at one end of the V-shaped groove with impurities.